Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging

Tsao, L. C.

doi:10.5772/33228

Cited by 12 publications

(8 citation statements)

References 56 publications

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“…Meanwhile, the anode reactions may be also quite complicated and some possible anodic reactions have been reported according to the literature

S n \to S {normaln}^{2 +} + 2 {normale}^{-}

S {normaln}^{2 +} \to S {normaln}^{4 +} + 2 {normale}^{-}

S {normaln}^{2 +} + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{2}

S n + 2 O {normalH}^{-} \to S n O + {normalH}_{2} O + 2 {normale}^{-}

S n {(normalO normalH)}_{2} + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{4} + {2 e}^{-}

S n O + {normalH}_{2} O + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{4} + 2 e^{-}

…”

Section: Resultsmentioning

confidence: 99%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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The corrosion characteristics of Sn‐3.0Ag‐0.5Cu solder under polyvinyl chloride (PVC) and polyethylene (PE) fire smoke atmospheres were investigated by weight loss method and surface characterization techniques. The corrosion kinetics results of 15‐day tests show that the mass loss of Sn‐3.0Ag‐0.5Cu solder in PE smoke is much lower than that in PVC smoke. The former shows no significant variation during the test. In contrast, the latter increases rapidly first and then presents a slow exponential increase. Microstructure analysis indicates that no obvious corrosion product appeared in PE smoke. Nevertheless, the corrosion products in PVC smoke grow larger first and then become smaller and denser. The possible growth process of corrosion products is that grain growth dominates the formation of the corrosion products at the initial stage and then the nucleation process is predominant. Furthermore, the corrosion mechanisms of Sn‐3.0Ag‐0.5Cu solder in the different fire smoke are also analyzed. Stannous oxide and stannic oxide are regarded as the corrosion products under both PE and PVC smoke atmospheres, while Sn21Cl16(OH)14O6 is only observed under PVC smoke atmosphere.

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“…Meanwhile, the anode reactions may be also quite complicated and some possible anodic reactions have been reported according to the literature

S n \to S {normaln}^{2 +} + 2 {normale}^{-}

S {normaln}^{2 +} \to S {normaln}^{4 +} + 2 {normale}^{-}

S {normaln}^{2 +} + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{2}

S n + 2 O {normalH}^{-} \to S n O + {normalH}_{2} O + 2 {normale}^{-}

S n {(normalO normalH)}_{2} + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{4} + {2 e}^{-}

S n O + {normalH}_{2} O + 2 O {normalH}^{-} \to S n {(normalO normalH)}_{4} + 2 e^{-}

…”

Section: Resultsmentioning

confidence: 99%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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“…Pematerian merupakan salah satu teknologi utama untuk menyambungkan komponen mikroelektronik pada papan litar bercetak (Liew et al 2012;Yu et al 2006). Sambungan pateri sering terdedah kepada persekitaran yang mengakis yang akan mempercepatkan proses kakisan (Tsao 2012). Kakisan boleh berlaku disebabkan oleh kehadiran kelembapan, udara yang mengakis dan bekalan arus (Vimala et al 2009).…”

Section: Pengenalanunclassified

“…Fenomena ECM terjadi akibat kehadiran lembapan pada sistem konduktor-dielektrikkonduktor di bawah voltan pincang, lalu berlakunya proses elektrokimia dan pertumbuhan logam dendrit (Medgyes et al 2013). Apabila kakisan berlaku pada sambungan pateri, ia akan mengubah mikrostruktur pateri yang menyebabkan karat dan tapak permulaan retak, membawa kepada kemerosotan ciri mekanik sambungan pateri (Mizari et al 2011;Tsao 2012).…”

Section: Pengenalanunclassified

Kelakuan Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium Hidroksida pada Kepekatan yang Pelbagai

Salleh

Othman²,

Jalar³

2018

JSM

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Pengecilan saiz antarahubung dalam papan litar bercetak (PCB) membawa kepada migrasi elektrokimia (ECM) dan kemudiannya menyebabkan litar pintas. ECM merupakan salah satu jenis kakisan yang ketara menjejaskan kebolehtahanan kakisan kepada peralatan elektronik. Migrasi ini ialah fenomena ion logam bergerak dari satu kawasan ke kawasan yang lain di dalam medium logam, menyebabkan endapan berlaku di bahagian katod logam ataupun aloi. Justeru, kajian ini dijalankan untuk menentukan kelakuan kakisan melalui ujian titisan air (WDT) pateri bebas plumbum Sn-3.0Ag-0.5Cu (SAC305) di dalam larutan natrium hidroksida (NaOH) yang berbeza kepekatan iaitu 0.05M, 0.1M, 0.5M dan 1.0M. Purata masa-ke-kegagalan (MTTF) pateri SAC305 berkurangan apabila didedahkan kepada medium larutan NaOH yang semakin tinggi kepekatannya. Pembentukan dendrit dikesan selepas kakisan pateri SAC305 akibat proses ECM dan menyebabkan litar pintas. Hasil kakisan Cu(OH) 2 dan SnO 2 juga didapati terbentuk selepas pateri terkakis. Bopeng kecil kelihatan terbentuk terutamanya pada kepekatan yang tinggi adalah disebabkan oleh perlarutan pada anod Sn.

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“…Examples of basic compositions are Au-Sn, Bi-Sn, Sn-Ag, Sn-Cu, Sn-In and Sn-Zn. However, the properties of these binary alloy systems are far away from any applications [3]. In the next development, ternary solders are proposed, such as Sn-Ag-Cu, Sn-AgBi and Sn-Zn-Bi solders.…”

Section: Compositionmentioning

confidence: 99%

Introductory Chapter: Overview of Recent Progress in Soldering Materials

Mohamad¹

2017

Recent Progress in Soldering Materials

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Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging

Cited by 12 publications

References 56 publications

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Kelakuan Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium Hidroksida pada Kepekatan yang Pelbagai

Introductory Chapter: Overview of Recent Progress in Soldering Materials

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