Kesan tiubnano karbon (CNT) terhadap pertumbuhan lapisan sebatian antara logam (IMC) bagi sistem pateri bebas plumbum 96.5Sn-3.0Ag-0.5Cu/substrat Cu telah dikaji. Serbuk aloi SnAg -Cu (SAC305) dicampurkan dengan 0.02 peratus berat CNT untuk menghasilkan pes pateri SAC305-CNT. Kedua-dua pes pateri SAC305 dan SAC305-CNT dicetak secara manual di atas permukaan papan litar bercetak (PCB) dengan kemasan kuprum (Cu) menggunakan kaedah percetakan stensil. Sampel yang telah dicetak dikenakan proses pematerian aliran semula pada suhu 260°C. Sampel yang sudah terpateri dikenakan ujian penuaan terma selama 200, 400, 600, 800 dan 1000 jam menggunakan ketuhar penyimpanan suhu tinggi (HTS) pada suhu malar iaitu 150°C. Ketebalan lapisan sebatian antara logam (IMC) diukur menggunakan alat Pengukuran Fokus Tak Terhingga (IFM ®). Keputusan kajian mendapati kadar pertumbuhan lapisan IMC bagi sistem SAC305/Cu-CNT adalah 25% lebih rendah berbanding dengan sistem SAC/Cu. Maka, dicadangkan bahawa penambahan CNT boleh merencatkan pertumbuhan lapisan IMC sebanyak 25% akibat penuaan terma.
Influence of temperature on corrosion inhibition for carbon steel by rice straw extract in HCl solution: Synergistic effect of cationic surfactant AIP Conf. Proc. 1571, 48 (2013); 10.1063/1.4858628The study of palm oil methyl ester and its corrosiveness AIP Conf.Abstract. The behavior of carbon steel SAE 1045 in 1 M NaOH solution containing different concentrations of palm kernel oil (PKO) has been studied by weight loss and polarization measurement. Results showed that the corrosion of carbon steel in NaOH solution was considerably reduced in presence of such inhibitors. The inhibition efficiency increases when concentration of inhibitor increase. Maximum inhibition efficiency (≈ 96.67%) is obtained at PKO concentration 8 v/v %. This result revealed that palm kernel oil can act as a corrosion inhibitor in an alkaline medium. Corrosion rates of carbon steel decrease as the concentration of inhibitor is increased.
In this paper, porous flower-like nickel oxide (NiO) on glass substrates were prepared by an aqueous chemical growth based technique. The morphology and optical observed were found to be influence by the reaction time. Field Emission Scanning Electron Microscopy (FESEM) revealed a porous flower-like structure growth on the substrates investigated. The optical band gap for NiO thin film calculated from transmission spectra has increased from 3.72 eV to 3.91 eV with the increasing of reaction time. This result shows that the growth time have some influence on morphology and optical of NiO films.
Solder printing faces challenges in print definition and sustainable volume transfer as the microelectronic industry migrates to smaller footprints. Nano-sized alloy particles mitigate these issues by modifying the solder formulation and rheology. We propose an electrodeposition method using reverse microemulsion (without reducing agent) as electrolyte to synthesize Sn-Ag-Cu solder alloy nanoparticle. SnCl 2 .2H 2 O, Ag 2 SO 4 and CuSO 4 are used as the precursor. N-hexane, TritonX-100 and n-hexanol are used as oil phase, surfactant and co-surfactant, respectively. Three volume ratios of aqueous to surfactant phase, W o are carried out namely: 0.20, 0.40 and 0.60 but only the ratio of 4.5:1.0 is able to synthesize the nano-sized SAC particles. Scanning electron microscopy shows the spherical SAC particles are well dispersed and their sizes range from 15 to 90 nm. X-ray diffraction spectra show the formation of Sn, Ag 3 Sn and Cu 6 Sn 5 without any oxide peaks in the synthesized nanoparticles; their absence suggests the effectiveness of the surfactants in protecting the alloy particles from oxidation. This electrodeposition method compares favourably to the microemulsion (with reducing agent) method in producing spherical and well-distributed nanosized solder particles.
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