N‐polar InN/InAlN heterostructure growth and performance are studied on‐ and off‐axis sapphire substrates misoriented toward the m or a plane by 4°. A high In molar fraction (0.57) in the InAlN layer is chosen to reduce the lattice mismatch. InN growth on the on‐axis InAlN/sapphire system is initiated with random island formation, which coalesce at ≈10 nm thickness smearing grain boundaries. In contrast, on off‐axis sapphires, growth is defined by misorientation‐induced steps and grains remain visible even after the layer coalesces. The best electron mobility of 720 cm2 V−1 s−1 and carrier density of ≈1.5 × 1019 cm−3 are demonstrated on the heterostructure grown on‐axis sapphire, with InN as thin as 20 nm, even though the InN/InAlN interface root mean square roughness is ≈1.3 nm. The concentrations of screw and edge dislocations in the 20 nm thick InN grown on the on‐axis system are extracted to be 4.7 × 109 and 3.5 × 1010 cm−2. In all cases, the InN lattice is still partially strained, performing only ≈85% relaxation. Further lowering of the lattice mismatch, smoothing of the InAlN surface, and achieving semi‐insulating InAlN will provide necessary development steps toward predicted InN‐channel transistors with unprecedented performance.