2005
DOI: 10.1063/1.1873049
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Correlation of nanochemistry and electrical properties in HfO2 films grown by metalorganic molecular-beam epitaxy

Abstract: We present the annealing effects on nanochemistry and electrical properties in HfO2 dielectrics grown by metalorganic molecular-beam epitaxy. After the postannealing treatment of HfO2 films in the temperature range of 600–800°C, the thicknesses and chemical states of the films were examined by high-resolution transmission electron microscopy and angle-resolved x-ray photoelectron spectroscopy. By comparing the line shapes of core-level spectra for the samples with different annealing temperatures, the concentr… Show more

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Cited by 18 publications
(10 citation statements)
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“…However, the performance of these devices is severely constrainted due to the low dielectric constant of SiO 2 gate dielectric layers. In contrast, HfO 2 has steadily emerged as an important candidate to work as a gate insulator due to its high dielectric constant and relatively low leakage current [6][7][8][9][10][11][12][13][14]. As a result, integrating ZnO nanowire FETs with HfO 2 gate insulators is expected to deliver substantially enhanced device performance such as transconductance (g m ), current on/off ratio (I on /I off ), and carrier mobility (µ e ).…”
Section: Introductionmentioning
confidence: 99%
“…However, the performance of these devices is severely constrainted due to the low dielectric constant of SiO 2 gate dielectric layers. In contrast, HfO 2 has steadily emerged as an important candidate to work as a gate insulator due to its high dielectric constant and relatively low leakage current [6][7][8][9][10][11][12][13][14]. As a result, integrating ZnO nanowire FETs with HfO 2 gate insulators is expected to deliver substantially enhanced device performance such as transconductance (g m ), current on/off ratio (I on /I off ), and carrier mobility (µ e ).…”
Section: Introductionmentioning
confidence: 99%
“…The enhanced accumulation capacitance is due to the increased concentration of silicate with its high dielectric constant. [16] Oxygen vacancies are the principal source of oxide charges and bulk defects in Ta 2 O 5 , and they can be efficiently reduced in an oxidizing ambience at the beginning or during the deposition step and by post-annealing treatments. Figure 4 shows the C-V characteristics of the samples deposited in working gas with different O 2 /Ar ratios and subsequently annealed at 700 • C in pure Ar ambience.…”
Section: C-v C-v C-v and Dielectric Characteristicsmentioning
confidence: 99%
“…On the other hand, optical applications require uniform, smooth, dense and stoichiometric films, since the extrinsic causes of optical losses include surface roughness, impurities, film composition and structural non-uniformity. The overall performance of an optical coating depends Various physical and chemical methods have been employed to grow HfO2 thin films, such as electron-beam evaporation [11], reactive ion plating [12], metal-organic molecular beam epitaxy [13], atomic layer deposition [14,15], etc. Each method has its own merits and demerits.…”
Section: Introductionmentioning
confidence: 99%