1977
DOI: 10.1109/jssc.1977.1050913
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Correlation of fabrication process and electrical device parameter variations

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Cited by 21 publications
(2 citation statements)
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“…Process modeling.--As semiconductor processing has matured and extremely sophisticated computer technology has been developed, projects have been initiated to establish advanced models of the various processes and to adapt them to computer programs (209)(210)(211). The goal of these various activities is to provide computer programs wl~lch can ptot out dopant and other structural profiles resulting from a sequence o5 high temperature treatments, and ultimately to predict resulting device and circuit characteristics.…”
Section: Miscellaneousmentioning
confidence: 99%
“…Process modeling.--As semiconductor processing has matured and extremely sophisticated computer technology has been developed, projects have been initiated to establish advanced models of the various processes and to adapt them to computer programs (209)(210)(211). The goal of these various activities is to provide computer programs wl~lch can ptot out dopant and other structural profiles resulting from a sequence o5 high temperature treatments, and ultimately to predict resulting device and circuit characteristics.…”
Section: Miscellaneousmentioning
confidence: 99%
“…In general, far fewer orthogonal components are needed to generate the device-model instances when using either a process simulator or principle components because the variations in device parameters are strongly correlated [19], [20]. For example, as will be seen in Section V, when using this method to generate BSIM device models with approximately 60 variable parameters, only 11 principle components were needed.…”
Section: B Generating Design Instancesmentioning
confidence: 99%