Correlation between special grain boundaries and electromigration behavior of aluminum thin films

Thermoreflectance imaging of electromigration evolution in asymmetric aluminum constrictions

“…The slitlike void shape may be due to the electromigration-induced diffusion along the void surface 32,33 and is influenced by the orientation of crystallographic surface planes and grain boundaries in the metal. [34][35][36] The cross-sectional temperature distribution along the black dashed line in Fig. 9(a) is plotted in Fig.…”