Control of Ionization Processes in Magnetron Sputtering System by Changing Magnetic Field Configuration

Chunadra, А.G.; Sereda, K. N.; Tarasov, I. K.; Makhlai, V.А.

doi:10.46813/2021-131-102

Cited by 1 publication

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“…The so-called magnetic isolation of the anode avoids an increase of magnetic field strength near the target surface. An increase of the magnetron sputtering process efficiency occurs due to the appearance of an additional ionization zone in the near anode region of the discharge gap [2].…”

Section: Introductionmentioning

confidence: 99%

Influence of Magnetic Field Configuration and Strength on Plasma Parameters and Efficiency of Coatings Deposition in Magnetron Sputtering System

Chunadra¹,

Sereda²,

Tarasov³

et al. 2022

Problems of Atomic Science and Technology

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Paper presents results of evaluation of the influence of the parameters of the additional anode electromagnetic trap for discharge electrons in a magnetron sputtering system. The efficiency of ionization processes is also investigated. It has been shown experimentally that a slight increase of the additional anode magnetic field leads to an increase of plasma density in the discharge on several times. The presence of an anode electromagnetic trap causes additional ionization zones. An increase of anode magnetic field leads to an increase of the average energy of charged discharge plasma particles. As the result, it was observed an intensification of the target material sputtering process as well as an increase of coatings deposition rate. In addition, a slight increase in the magnitude of the anode magnetic field has a positive effect on the quality and purity of the deposited coatings.

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Section: Introductionmentioning

confidence: 99%