2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) 2014
DOI: 10.1109/ipec.2014.6869792
|View full text |Cite
|
Sign up to set email alerts
|

Contactless DC connector based on GaN LLC converter for next generation data centers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
8
0

Year Published

2014
2014
2019
2019

Publication Types

Select...
4
4

Relationship

2
6

Authors

Journals

citations
Cited by 9 publications
(8 citation statements)
references
References 10 publications
0
8
0
Order By: Relevance
“…Volumes generated from the inductor and the heat sink were considered here. The heat sink volume was estimated simply by using the heat dissipation efficiency k HS of 0.65 W/cm 3 taking the forced-air cooling in data centers into account [22]. From Fig.…”
Section: High Power Density Design Methodologymentioning
confidence: 99%
“…Volumes generated from the inductor and the heat sink were considered here. The heat sink volume was estimated simply by using the heat dissipation efficiency k HS of 0.65 W/cm 3 taking the forced-air cooling in data centers into account [22]. From Fig.…”
Section: High Power Density Design Methodologymentioning
confidence: 99%
“…The loss analysis and the volume estimation has been already carried out for the LLC resonant dc-dc converter using the high frequency transformer (19) . The circuit configuration corresponded to Fig.…”
Section: Volume and Power Loss Estimation Of Passive Components In DCmentioning
confidence: 99%
“…The design method of LLC converter resonant parameters has already been thoroughly detailed in many papers [1, 2]. However, the design difficulties of converter hardware are becoming more and more challenging as the switching speed is increasing, especially when the emerging gallium nitride (GaN) high‐electron‐mobility transistor (HEMT) are adopted [3, 4].…”
Section: Introductionmentioning
confidence: 99%