2019
DOI: 10.1049/joe.2019.0081
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Virtual prototype and GaN HEMT based high frequency LLC converter design

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Cited by 4 publications
(3 citation statements)
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“…Considering that large Lds also causes large turn-on and turn-off overvoltage as in [8], [21], [24], [25], thus Lds should be controlled as small as possible by optimal PCB layout and routing of power loop at the very beginning of power converter design.…”
Section: Optimal Design Of Power Loop Stray Inductancementioning
confidence: 99%
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“…Considering that large Lds also causes large turn-on and turn-off overvoltage as in [8], [21], [24], [25], thus Lds should be controlled as small as possible by optimal PCB layout and routing of power loop at the very beginning of power converter design.…”
Section: Optimal Design Of Power Loop Stray Inductancementioning
confidence: 99%
“…The first type is trying to eliminate the intensity of exciting source that induces gate crosstalk voltage, among which the simplest way is to slow down the turn-on speed of GaN HEMT with large turn-on resistance, but it will increase the overlap loss during the turn-on transient [4]- [7]. By contrast, minimizing the power loop stray inductance by optimized layout and routing or deliberately designed snubber circuit seems more feasible [8]- [10]. Based on the mechanism analysis of crosstalk, the second type of false turn-on suppression method focuses on minimizing the impedance of gate turn-off loop [10]- [13].…”
Section: Introductionmentioning
confidence: 99%
“…The GaN device has a small on-voltage threshold range, fast switching, no reverse recovery loss, low on-resistance, and good high-frequency characteristics, and is able to switch voltage of hundreds of volts in a few nanoseconds [55][56][57] , which can replace siliconbased equipment even in high-frequency conditions of over 1 million Hz.…”
Section: The Future Evolution Of the Llc Resonant Convertermentioning
confidence: 99%