“…Sufficient temperature-dependent material data are available in the literature for BaTiO 3 , nickel, tin, silver, palladium, PbSn soft solder, epoxy, and copper. [11][12][13][14][15][16][17] Except for the coefficients of thermal expansion (␣), 18 data for a specific silver/palladium alloy were difficult to find. Therefore, most of its material properties were derived by interpolating the values of pure silver and palladium with uncertain accuracy.…”