Constant strain rate tensile properties of various lead based solder alloys at 0, 50, and 100°C

Finite‐Element Analysis of Ceramic Multilayer Capacitors: Failure Probability Caused by Wave Soldering and Bending Loads

“…Sufficient temperature-dependent material data are available in the literature for BaTiO 3 , nickel, tin, silver, palladium, PbSn soft solder, epoxy, and copper. [11][12][13][14][15][16][17] Except for the coefficients of thermal expansion (␣), 18 data for a specific silver/palladium alloy were difficult to find. Therefore, most of its material properties were derived by interpolating the values of pure silver and palladium with uncertain accuracy.…”

Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages

“…Details of the development of the FEM will be given in later publications. Linear material properties are given in Table 2 and the nonlinear properties for the 63Sn37Pb and 90Pb10Sn solders are given in Table 3 [31,32].…”

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

“…There are many research works on the mechanical behavior of Sn-Pb eutectic solder [3][4][5][6] and lead-free solder alloys [7][8][9]. However, there are still many issues to be solved for composite solder materials, especially those reinforced with nano-sized metallic particles.…”