Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

Rao, B.S.S. Chandra; Kumar, K. Mohan; Kripesh, V.; Zeng, Kaiyang

doi:10.1016/j.msea.2011.01.115

Materials Science and Engineering: A

2011

DOI: 10.1016/j.msea.2011.01.115

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Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

B.S.S. Chandra Rao

K. Mohan Kumar

V. Kripesh

et al.

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Cited by 11 publications

References 23 publications

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Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

Cited by 11 publications

References 23 publications

Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test

Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test

Effects of Ag particles content on properties of Sn0.7Cu solder

Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

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