Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages

Perkins, Andrew E.; Sitaraman, Suresh K.

doi:10.1016/j.microrel.2006.12.004

Cited by 10 publications

(3 citation statements)

References 34 publications

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“…The finite element modeling of SnAgCu/SnAgCuCe solder joints in QFP devices was performed to examine and quantify the effects of the element Ce on the stress-strain response in the solder joints. Finite element analysis (FEA) is widely used in the electronic packaging technology in order to model the physics of failure in solder joints subjected to thermal cycling condition (Chen et al, 2005;Perkins and Sitaraman, 2007;Ghorbani and Spelt, 2007;Hegde et al, 2008). Moreover, the melting point of most solder materials for electronics is relatively low (Zhang et al, 2008a), for instance, the room temperature (298 K) is 0.6 of the melting point of Sn3.8Ag0.7Cu alloy (400 K).…”

Section: Finite Element Analysismentioning

confidence: 99%

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Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Zeng

Xue²,

Zhang³

et al. 2010

Soldering &Amp; Surface Mount Technology

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2012),"The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process", Soldering & Surface Mount Technology, Vol. 24 Iss 3 pp. 216-222 http://dx.If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to numerically evaluate the reliability of SnAgCuCe solder joints compared with that of SnAgCu. A trace amount of the rare earth (RE) element Ce was added into SnAgCu solder in order to improve the reliability of lead-free solder joints, which was evaluated based on finite element simulation and experiments. Design/methodology/approach -A finite element method and an Anand constitutive model were employed to analyze the reliability of SnAgCuCe and SnAgCu solder joints in fine pitch quad flat packages under thermal cycling. The mechanical properties and reliability of solder joints were characterized by using thermal fatigue and creep tests, while the microstructure of the solder alloy and SnAgCu/SnAgCuCe solder joints were also investigated in the experimental procedure. Findings -The simulation results indicated that SnAgCuCe solder joints had better reliability than SnAgCu. In addition, the experimental results accorded well with those of simulation, the thermal fatigue property and creep resistance of solder joints was increased by adding cerium. SnAgCuCe alloy can get its microstructure refinement improved and the thickness of the intermetallic compound layer at the solder/Cu interface decreased significantly compared to that of SnAgCu. Originality/value -The findings provide certain guidelines to the reliability evaluation of solder joints when applying novel RE containing solder alloys in practical electronics industry applications. In the meantime, the reason for the superior reliability of SnAgCuCe solder joints can be explained from the property and microstructural point-of-view.

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Section: Finite Element Analysismentioning

confidence: 99%

“…In this case, the rate-dependence of the plastic and creep deformations should be considered in models. In the present work, Anand models were employed to describe the stress-strain constitutive behaviour of solders (Perkins and Sitaraman, 2007):…”

Section: Finite Element Analysismentioning

confidence: 99%

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Zeng

Xue²,

Zhang³

et al. 2010

Soldering &Amp; Surface Mount Technology

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“…The flip chip technology is widely applied in MEMS, in which solder joints are used as both mechanical supports and interconnections between electronic components [17,18]. However, under cyclic thermal loads, solder joints always tend to fatigue failure resulting from the mismatched thermal expansion of the materials in the solder joints [14,19]. Therefore, the thermal fatigue life of a solder joint under cyclic thermal loads is directly related to the safe operation and reliability of the entire electronic device [20].…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Han

Shao

et al. 2019

Energies

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Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Under cyclic thermal loading, a theoretical heat transfer and thermal stress model is developed for the flip chip components and the thermal fatigue lives of flip chip component solder joints are analyzed. The model based simulation results show the effects of environmental and power parameters on thermal fatigue life. It is indicated that under cyclic thermal loading, the solder joint with the shortest life in a package of flip chip components is located at the outer corner point of the array. Increment in either power density or ambient temperature or the decrease in either power conversion time or ambient pressure will result in short thermal fatigue lives of the key solder joints in the flip chip components. In addition, thermal fatigue life is more sensitive to power density and ambient temperature than to power conversion time and ambient air pressure.

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Reliability of Electronic Packaging

2023

Springer Handbooks

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Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages

Cited by 10 publications

References 34 publications

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Reliability of Electronic Packaging

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