Conductive SU8 Photoresist for Microfabrication

Jiguet, Sébastien; Bertsch, Arnaud; Hofmann, Heinrich; Renaud, Philippe

doi:10.1002/adfm.200400575

Cited by 84 publications

(70 citation statements)

References 23 publications

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“…Increasing the amount of the conductive filler reduces the electrical resistivity of the PDMS composite matrix by adding more interconnected clusters of silver particles into conducting paths. [33,34] Therefore, as shown in Figure 5, we have experimentally observed that a sudden decrease of electrical resistivity occurs at a percolation threshold around 18 vol %, compared with the theoretical prediction of 16 vol % (assuming a simple binary composite with spherical particles distributed statistically). [35,36] Here, we attribute the 2% variation from the theoretical prediction to the non-ideal shape and size distribution of the silver clusters.…”

Section: Electrical Conductivitymentioning

confidence: 91%

Photopatternable Conductive PDMS Materials for Microfabrication

Cong

Pan

2008

Adv Funct Materials

174

122

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Conductive photodefinable polydimethylsiloxane (PDMS) composites that provide both high electrical conductivity and photopatternability have been developed. The photosensitive composite materials, which consist of a photosensitive component, a conductive filler, and a PDMS pre‐polymer, can be used as a negative photoresist or a positive photoresist with an additional curing agent. A standard photolithographic approach has been used to fabricate conductive elastomeric microstructures. Feature sizes of 60 µm in the positive photoresist and 10 µm in the negative photoresist have been successfully achieved. Moreover, as the conductive filler, silver powders significantly improve the electrical conductivity of the PDMS polymer, but also provide enhanced mechanical and thermal properties as well as interesting biological properties. The combined electrical, mechanical, thermal, and biological properties along with photopatternability make the PDMS‐Ag composite an excellent processable and structural material for various microfabrication applications.

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Section: Electrical Conductivitymentioning

confidence: 91%

Photopatternable Conductive PDMS Materials for Microfabrication

Cong

Pan

2008

Adv Funct Materials

174

122

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“…At present, the unoptimized conducting polymer composite demonstrates a large contact resistance with the embedded Si micropillars compared to that of metal-Si ohmic contacts [74], [75] due to inefficient electron exchanges between semiconductor and electron/hole-transporting polymers [76]. Efforts are currently underway to decrease the contact resistance by optimizing the conducting polymer-metal composite and forming a thermoplastic metal nanoparticle conducting polymer [77].…”

Section: Resultsmentioning

confidence: 99%

Harvesting and Transferring Vertical Pillar Arrays of Single-Crystal Semiconductor Devices to Arbitrary Substrates

Logeeswaran

Katzenmeyer

Islam

2010

IEEE Trans. Electron Devices

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Abstract-Development of devices that can be fabricated on amorphous substrates using multiple single-crystal semiconductors with different physical, electrical, and optical characteristics is important for highly efficient portable and flexible electronics, optoelectronics, and energy conversion devices. Reducing the use of single-crystal substrates can contribute to low-cost and environmentally benign devices covering a large area. We demonstrate a technique to harvest and transfer vertically aligned single-crystal semiconductor micro-and nanopillars from a singlecrystal substrate to a low-cost carrier substrate while simultaneously preserving the integrity, order, shape, and fidelity of the transferred pillar arrays. The transfer technique facilitates multilayer process integration by exploiting a vertical embossing and lateral fracturing method using a spin-coated polymer layer on a carrier substrate. Electrical contacts are formed using a bilayer of metal and conducting polymer such as gold (Au) and polyaniline (PAni). In this method, the original single-crystal substrate can be repeatedly used for generating more devices and is minimally consumed, whereas in conventional fabrication methods, the substrate is employed solely as a mechanical support. This heterogeneous integration technique potentially offers devices with low physical fill factor contributing to lower leakage current and noise, reduced parasitic capacitance, and enhanced photon-semiconductor interactions, and enables heterogeneous multimaterial integration such as silicon with compound semiconductors for rapidly expanding large-scale applications, including low-cost and flexible electronics, displays, tactile sensors, and energy conversion systems.Index Terms-Compound semiconductors, heterogeneous material integration, integrated multifunctional devices, micro/ nano-pillars, photon traps, vertical device arrays, 3-D material integration.

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“…The photo curing kinetics of SU-8 with and without silica nanoparticles have been studied [100]. The SU-8 was made conductive by addition of silver nanoparticles [101] and ferromagnetic by addition of nickel nanospheres [28]. Refractive index was changed by adding a liquid aliphatic resin [29].…”

Section: Bulk Modificationmentioning

confidence: 99%

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

et al. 2007

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Since its introduction in the nineties, the negative resist SU-8 has been increasingly used in micro- and nanotechnologies. SU-8 has made the fabrication of high-aspect ratio structures accessible to labs with no high-end facilities such as X-ray lithography systems or deep reactive ion etching systems. These low-cost techniques have been applied not only in the fabrication of metallic parts or molds, but also in numerous other micromachining processes. Its ease of use has made SU-8 to be used in many applications, even when high-aspect ratios are not required. Beyond these pattern transfer applications, SU-8 has been used directly as a structural material for microelectromechanical systems and microfluidics due to its properties such as its excellent chemical resistance or the low Young modulus. In contrast to conventional resists, which are used temporally, SU-8 has been used as a permanent building material to fabricate microcomponents such as cantilevers, membranes, and microchannels. SU-8-based techniques have led to new low-temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab-on-chip. First, this article aims to review the different techniques and provides guidelines to the use of SU-8 as a structural material. Second, practical examples from our respective labs are presented.

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Conductive SU8 Photoresist for Microfabrication

Cited by 84 publications

References 23 publications

Photopatternable Conductive PDMS Materials for Microfabrication

Photopatternable Conductive PDMS Materials for Microfabrication

Harvesting and Transferring Vertical Pillar Arrays of Single-Crystal Semiconductor Devices to Arbitrary Substrates

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

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