Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

Ramachandran, Koushik; Liu, Fuhan; Raj, P. Markondeya; Tummala, Rao

doi:10.1007/s11664-012-2274-4

Cited by 7 publications

(3 citation statements)

References 16 publications

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“…Moisture absorption of the epoxy-glass fiber composite material was characterized using gravimetric measurements after exposure to different values of RH at 60°C for a duration of 4 h in a humidity chamber. The procedure for gravimetric measurement has been previously described [2]. The results of gravimetric measurement at different RH values are summarized in Table 1.…”

Section: Methodsmentioning

confidence: 99%

“…Electrical interconnections on FR4 boards are typically established using through-holes that are drilled and plated with copper to interconnect components on either side of the board. Copper plated-through-holes (PTHs), however, under DC voltage bias in the presence of humidity and temperature pose reliability concerns [1][2][3][4]. Catastrophic failures (i.e., electrical insulation failures) due to electrochemical migration between PTHs in FR4s in the presence of humidity and DC bias have been reported by several researchers [5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

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Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy

Ramachandran

Pruyn

Huang

et al. 2015

J Mater Sci: Mater Electron

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AC impedance spectroscopy was used to investigate copper plated-through-holes (PTH) in glass fiber reinforced epoxy substrates (FR4) at different stages of temperature-humidity-bias driven electrochemical migration failure. The test vehicles consisted of PTHs arranged in an alternate anode and cathode configuration in FR4 boards. The test vehicles were subjected to accelerated stress testing [130°C, 85 % relative humidity (RH) and 100 V DC] to initiate a specific sub-surface electrochemical failure mode referred to as conductive anodic filament (CAF) formation. The test vehicle variations included a control with no exposure, test vehicle with electrical insulation failure (resistance change to 1 MX during the test) and test vehicle with initiation of CAF to compare the impedance characteristics at different stages of electrochemical migration failure. AC impedance measurements were carried out on the test vehicle variations at ambient and in an in situ humidity chamber as a function of RH at 14-85 %. The prior exposure condition of the test vehicles was found to have a strong effect on the impedance characteristics at different RH values. The accelerated testing results and impedance characteristics of the PTHs in epoxy-glass fiber substrates are discussed.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy

Ramachandran

Pruyn

Huang

et al. 2015

J Mater Sci: Mater Electron

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“…Unmasked regions of the copper foil are removed during the etching process. The trend towards performance improvement by miniaturization and consequently the decrease in the distance between the conduction paths affects not only the in-service behavior [9][10][11] but also the production of PCBs [12]. In spray etching, the narrow spacing between masked regions and the comparatively high layer thicknesses of the mask constitute a surface structure with cavities, wherein the etching reaction takes place.…”

Section: Introductionmentioning

confidence: 99%

Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs

Eßl

Reiss

Raninger

et al. 2023

Fluids

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Multi-droplet impingement is a fundamental aspect inherent to all kinds of technical spray processes which typically aim at enhancing the convective exchange of reagents or heat at the impinged surface. In this paper, the impingement of multiple droplets onto a structured surface is investigated by a comprehensive CFD model, which resolves the dynamics of the individual droplets and the film on a micro-scale level based on the Volume of Fluid (VOF) method. The considered surface topology includes cavities and is typical for protective masks used in the spray etching of Printed Circuit Boards (PCBs). The agitation of the liquid film in terms of the convective mass transfer rates across virtual horizontal evaluation planes is studied and the influence of film height and droplet impaction velocity is elaborated. Passive tracer tracking is employed to investigate the release and re-entrainment of fluid at the surface cavities. Two modes of mass exchange between the cavities and the main flow upon droplet impingement are identified, which are central inflow accompanied by lateral outflow (1) and lateral inflow with outflow at the opposing side (2). A statistical analysis of the allocation of tracer particles shows that high impaction velocities and low film heights correlate with an enhanced decay of tracer particles within the cavities. The susceptibility to re-entrainment is also reduced by high impaction velocities, whereas increased film heights are found to promote re-entrainment.

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Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

Ramachandran

Ready

Raj

et al. 2014

J Mater Sci: Mater Electron

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Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

Cited by 7 publications

References 16 publications

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy

Numerical Analysis of Convective Mass Transfer during Multi-Droplet Impingement on a Structured Surface in the Presence of an Adhered Liquid Film—An Application to Spray Etching of PCBs

Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

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