2014
DOI: 10.1063/1.4903288
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Compressively strained SiGe band-to-band tunneling model calibration based on p-i-n diodes and prospect of strained SiGe tunneling field-effect transistors

Abstract: Band-to-band tunneling parameters of strained indirect bandgap materials are not well-known, hampering the reliability of performance predictions of tunneling devices based on these materials. The nonlocal band-to-band tunneling model for compressively strained SiGe is calibrated based on a comparison of strained SiGe p-i-n tunneling diode measurements and doping-profile-based diode simulations. Dopant and Ge profiles of the diodes are determined by secondary ion mass spectrometry and capacitance-voltage measu… Show more

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Cited by 23 publications
(6 citation statements)
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“…However, once these hurdles are taken, we expect to arise a highly competitive and attractive platform solution for future data processing applications. In fact, the extension of CMOS by integration of Ge and (Si)GeSn may not just resolve the demands for a monolithic laser gain medium, but, as discussed widely elsewhere (Kao et al, 2014), (Si)GeSn would already advance the performance of the electronic circuits. This appealing double benefit, together with the potential compatibility to CMOS of such an all-group-IV solution, bears an essential advantage in comparison to other emerging technologies, such as spin-and/or valley-based electronics, which rely in part on non-conform chemical elements and non-CMOS fabrication processes.…”
Section: Cmos Integrationmentioning
confidence: 99%
“…However, once these hurdles are taken, we expect to arise a highly competitive and attractive platform solution for future data processing applications. In fact, the extension of CMOS by integration of Ge and (Si)GeSn may not just resolve the demands for a monolithic laser gain medium, but, as discussed widely elsewhere (Kao et al, 2014), (Si)GeSn would already advance the performance of the electronic circuits. This appealing double benefit, together with the potential compatibility to CMOS of such an all-group-IV solution, bears an essential advantage in comparison to other emerging technologies, such as spin-and/or valley-based electronics, which rely in part on non-conform chemical elements and non-CMOS fabrication processes.…”
Section: Cmos Integrationmentioning
confidence: 99%
“…Both the lattice and band gap expansions become significant around the same Ca content of ∼15%. The concept of strain engineering the band gap has been used in many semiconductors 46 and may play a role here. D. Photochromism.…”
Section: Resultsmentioning
confidence: 99%
“…As stated earlier Kao et al performed an analysis of compressive and tensile strain effects in TFET devices. 23,24 It can be seen in those works that strain can have a large impact on drive current in TFETs. For simplicity strain effects are not Fig.…”
Section: Resultsmentioning
confidence: 97%
“…Verhulst et al recently did a comparative analysis of n-channel and p-channel TFETs [20] and provided a perspective of TFETs for future low power technology [21]. Furthermore that group has many experimental TFET demonstrations [22], as well as an analysis of compressive and tensile strain effects in TFET devices [23,24].…”
Section: Introductionmentioning
confidence: 99%