Direct bandgap group IV materials may thus represent a pathway towards the monolithic integration of Si-photonic circuitry and CMOS technology.Although a group IV direct bandgap material has not been demonstrated yet, silicon photonics using CMOS-compatible processes has made great progress through the development of Si-based waveguides 12 , photodetectors 13 and modulators 14 . The thus emerging technology is rapidly expanding the landscape of photonics applications towards tele-and data communication as well as sensing from the infrared to the mid infrared wavelength range 15-17 . Today's light sources of such systems are lasers made from direct bandgap group III-V materials operated off-or on-chip which requires fibre coupling or heterogeneous integration, for example by wafer bonding 3 , contact printing 4,5 or direct growth 6,7 , respectively. Hence, a laser source made of a direct bandgap group IV material would further boost lab-on-a-chip and trace gas sensing 15 as well as optical interconnects 18 by enabling monolithic integration. In this context, Ge plays a prominent role since the conduction band minimum at the -point of the Brillouin-zone (referred to as -valley) is 3 located only approx. 140 meV above the fourfold degenerate indirect L-valley. To compensate for this energy difference and thus form a laser gain medium, heavy n-type doping of slightly tensile strained Ge has been proposed 19 . Later, laser action has been reported for optically 20 and electrically pumped Ge 21 doped to approx. 1 and 4×10 19 cm -3 , respectively. However, pump-probe measurements of similarly doped and strained material did not show evidence for net gain 22 , and in spite of numerous attempts, researchers failed to substantiate above results up to today. Other investigated concepts concern the engineering of the Ge band structure towards a direct bandgap semiconductor using micromechanicallystressed Ge nanomembranes 9 or silicon nitride (Si 3 N 4 ) stressor layers 23 . Very recently, Süess et al. 10 presented a stressor-free technique which enables the introduction of more than 5.7 % 24 uniaxial tensile strain in Ge µ-bridges via selective wet under-etching of a pre-stressedlayer. An alternative technique in order to achieve direct bandgap material is to incorporate Sn atoms into a Ge lattice, which primarily reduces the gap at the -point. At a sufficiently high fraction of Sn, the energy of the -valley decreases below that of the L-valley. This indirect-to-direct transition for relaxed GeSn binaries has been predicted to occur at about 20 % Sn by Jenkins et al. 25 , but more recent calculations indicate much lower required Sn concentrations in the range of 6.5-11.0 % 26,27 . A major challenge for the realization of such GeSn alloys is the low (< 1 %) equilibrium solubility of Sn in Ge 28 and the large lattice mismatch of about 15 % between Ge and -Sn. For GeSn grown on Ge substrates, this mismatch induces biaxial compressive strain causing a shift of the  and L-valley crossover towards higher Sn concentrations ...

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The strong correlation between advancing the performance of Si microelectronics and their demand of low power consumption requires new ways of data communication. Photonic circuits on Si are already highly developed except for an eligible on-chip laser source integrated monolithically. The recent demonstration of an optically pumped waveguide laser made from the Si-congruent GeSn alloy, monolithical laser integration has taken a big step forward on the way to an all-inclusive nanophotonic platform in CMOS. We present group IV microdisk lasers with significant improvements in lasing temperature and lasing threshold compared to the previously reported nonundercut Fabry−Perot type lasers. Lasing is observed up to 130 K with optical excitation density threshold of 220 kW/cm 2 at 50 K. Additionally the influence of strain relaxation on the band structure of undercut resonators is discussed and allows the proof of laser emission for a just direct Ge 0.915 Sn 0.085 alloy where Γ and L valleys have the same energies. Moreover, the observed cavity modes are identified and modeled.

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Impact of the end of range damage from low energy Ge preamorphizing implants on the thermal stability of shallow boron profilesThe excess charge carrier lifetimes in Ge layers grown on Si or germanium-on-insulator are measured by synchrotron based pump-probe transmission spectroscopy. We observe that the lifetimes do not strongly depend on growth parameters and annealing procedure, but on the doping profile. The defect layer at the Ge/Si interface is found to be the main non-radiative recombination channel. Therefore, the longest lifetimes in Ge/Si (2.6 ns) are achieved in sufficiently thick Ge layers with a built-in field, which repels electrons from the Ge/Si interface. Longer lifetimes (5.3 ns) are obtained in overgrown germanium-on-insulator due to the absence of the defective interface. V C 2014 AIP Publishing LLC. [http://dx.

We show that hemispherical gold droplets on top of silicon nanowires when grown by the vapor-liquid-solid (VLS) mechanism, can produce a significant enhancement of Raman scattered signals. Signal enhancement for a few or even just single gold droplets is demonstrated by analyzing the enhanced Raman signature of malachite green molecules. For this experiment, trenches (approximately 800 nm wide) were etched in a silicon-on-insulator (SOI) wafer along <110> crystallographic directions that constitute sidewalls ({110} surfaces) suitable for the growth of silicon nanowires in <111> directions with the intention that the gold droplets on the silicon nanowires can meet somewhere in the trench when growth time is carefully selected. Another way to realize gold nanostructures in close vicinity is to attach a silicon nanowire with a gold droplet onto an atomic force microscopy (AFM) tip and to bring this tip toward another gold-coated AFM tip where malachite green molecules were deposited prior to the measurements. In both experiments, signal enhancement of characteristic Raman bands of malachite green molecules was observed. This indicates that silicon nanowires with gold droplets atop can act as efficient probes for tip-enhanced Raman spectroscopy (TERS). In our article, we show that a nanowire TERS probe can be fabricated by welding nanowires with gold droplets to AFM tips in a scanning electron microscope (SEM). TERS tips made from nanowires could improve the spatial resolution of Raman spectroscopy so that measurements on the nanometer scale are possible.

SiGeSn ternaries are grown on Ge‐buffered Si wafers incorporating Si or Sn contents of up to 15 at%. The ternaries exhibit layer thicknesses up to 600 nm, while maintaining a high crystalline quality. Tuning of stoichiometry and strain, as shown by means of absorption measurements, allows bandgap engineering in the short‐wave infrared range of up to about 2.6 µm. Temperature‐dependent photoluminescence experiments indicate ternaries near the indirect‐to‐direct bandgap transition, proving their potential for ternary‐based light emitters in the aforementioned optical range. The ternaries' layer relaxation is also monitored to explore their use as strain‐relaxed buffers, since they are of interest not only for light emitting diodes investigated in this paper but also for many other optoelectronic and electronic applications. In particular, the authors have epitaxially grown a GeSn/SiGeSn multiquantum well heterostructure, which employs SiGeSn as barrier material to efficiently confine carriers in GeSn wells. Strong room temperature light emission from fabricated light emitting diodes proves the high potential of this heterostructure approach.

Ge under high strain is predicted to become a direct bandgap semiconductor. Very large deformations can be introduced using microbridge devices. However, at the microscale, strain values are commonly deduced from Raman spectroscopy using empirical linear models only established up to ε 100 =1.2% for uniaxial stress. In this work, we calibrate the Raman-strain relation at higher strain using synchrotron based microdiffraction. The Ge microbridges show unprecedented high tensile strain up to 4.9 % corresponding to an unexpected Δω=9.9 cm -1 Raman shift. We demonstrate experimentally and theoretically that the Raman strain relation is not linear and we provide a more accurate expression.