2020
DOI: 10.1016/j.tsf.2019.137779
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Comprehensive analysis of blue diode laser-annealing of amorphous silicon films

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Cited by 13 publications
(10 citation statements)
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“…Laser processing can access regimes that are not achievable via conventional thermal treatment. In particular, blue-diode laser 22 has been introduced in thin film annealing owing to its scalability, continuous wave characteristics, high optical power density per unit area or volume, low cost, and high photon energy (2.82 eV) 23,24 . Considering that the light absorption of PDA is in the range of blue-diode laser wavelength (440 nm) 15 , we inferred that blue-diode laser annealing (BLA) could be employed to efficiently anneal and improve PDA properties.…”
mentioning
confidence: 99%
“…Laser processing can access regimes that are not achievable via conventional thermal treatment. In particular, blue-diode laser 22 has been introduced in thin film annealing owing to its scalability, continuous wave characteristics, high optical power density per unit area or volume, low cost, and high photon energy (2.82 eV) 23,24 . Considering that the light absorption of PDA is in the range of blue-diode laser wavelength (440 nm) 15 , we inferred that blue-diode laser annealing (BLA) could be employed to efficiently anneal and improve PDA properties.…”
mentioning
confidence: 99%
“…[1][2][3][4][5] However, the use of LTPS by excimer laser annealing (ELA) of a-Si is limited only for mobile displays because of the mother glass size. On the other hand, continuous-wave (CW) laser annealing, in particular, blue laser annealing (BLA), is of increasing interest to replace ELA [6][7][8][9][10][11][12] because ELA cannot support G8 or G10.5/11 for LTPS TFT backplane. Note that the high capital investment of the manufacturing system and operating cost are needed for ELA system and its maintenance.…”
Section: Introductionmentioning
confidence: 99%
“…6,7 The range of laser energy density of ELA for LTPS is narrower than that of BLA because the ELA uses a pulse laser and BLA uses CW laser. 8 The a-Si layer by BLA is crystallized by the scanning of laser beam, and thus, grains are continuously grown from the previously grown Si seed. On the other hand, the a-Si by ELA is crystallized from the bottom substrate by forming nucleation seed and lateral grain growth.…”
Section: Introductionmentioning
confidence: 99%
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“…However, ultra-low penetration depth of UV light to silicon limits the thickness of -Si film, which can be processed with such an approach. Visible laser radiation (in particular, blue and green lasers operating in CW and pulsed mode [ 1 , 16 , 17 , 18 , 19 , 20 ]) was shown to increase the maximal processing thickness to 150–200 nm; however, this is still not enough to cover all applications. Noteworthy, penetration depth of near-IR radiation into Si, which has good transparency in this spectral range (comparing to UV and visible light), is high enough to drive crystallization inside rather thick -Si films that are required for realistic applications and devices.…”
Section: Introductionmentioning
confidence: 99%