Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications

Lee, Byung-Suk; Lee, Chang-Woo; Yoon, Jeong‐Won

doi:10.1002/sia.5998

Cited by 17 publications

(2 citation statements)

References 15 publications

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“…Traditional Sn-based soldering, due to lower melting point and limited thermal conductivity, is hardpressed to satisfy the requirements of high-temperature service [9]. Hence, the Au80Sn20 solder alloy with a melting point of 280 ℃ was developed and reported to have superior thermal stability during aging at 150 and 200 ℃ compared to Sn-3.0Ag-0.5Cu [10]. However, the high processing temperature at approximately 300 ℃ and high cost make it difficult for wide applications.…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates

Xiaoting,

He,

Peng

et al. 2024

J. Phys.: Conf. Ser.

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As an emerging lead-free packaging interconnect material, Nano-Ag paste exhibits superior high-temperature mechanical, electrical, and thermal properties. It can meet the stringent high-temperature and high-density packaging requirements of future high-power semiconductor devices and is garnering widespread attention. However, research on the high-temperature reliability of sintered joints remains rather limited. In this study, we fabricated high-strength hot-press sintered nano-Ag joints using a hot-press sintering process. These joints underwent aging at high temperatures of 200°C and 300°C, yielding insights into the variations in mechanical properties at different temperatures. The reasons behind joint failure were analyzed by investigating the evolution of joint microstructures and fracture surfaces. The results indicate that even after extended aging at 200°C, the joint strength can still be maintained at 176 MPa. However, after aging for over 100 hours at 300°C, the joint fails. The growth of Cu oxides was observed within the joint microstructure, which constitutes the primary cause of joint failure at 300°C.

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Section: Introductionmentioning

confidence: 99%

High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates

Xiaoting,

He,

Peng

et al. 2024

J. Phys.: Conf. Ser.

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“…gold (Au). Thus, this system is widely considered in the flip-chip products in power electronics (Lee et al , 2016; Pittroff et al , 2001). In fact, the 80Au20Sn (wt.%) binary solders are the most common form of the gold-tin solders because of its considerably high melting point (280°C) and due to their improved mechanical properties (Ivey, 1998; Nakahara et al , 1981; Zhang et al , 2009).…”

Section: Introductionmentioning

confidence: 99%

A study on the thermomechanical response of various die attach metallic materials of power electronics

Gharaibeh,

Wilde

2024

SSMT

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Purpose In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis. Design/methodology/approach During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined. Findings The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations. Originality/value This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

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Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package

Wang

Xue

Han

et al. 2019

J Mater Sci: Mater Electron

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Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications

Cited by 17 publications

References 15 publications

High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates

High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates

A study on the thermomechanical response of various die attach metallic materials of power electronics

Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package

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