Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package

Wang, Liujue; Xue, Songbai; Han, Lei; Wang, Jianhao

doi:10.1007/s10854-019-02655-5

Cited by 5 publications

(2 citation statements)

References 23 publications

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“…e gold-based low-temperature solder mainly refers to a gold-based solder with a melting temperature less than 400 °C, such as Au-Sn, Au-Si, Au-Ge, and Au-Sb [15][16][17][18]. Gold-based low-temperature solders have excellent wettability, thermomechanical properties, and high corrosion resistance, which are the main soldering materials for hermetic packaging.…”

Section: Au-based Low-temperature Solder Alloysmentioning

confidence: 99%

“…Nevertheless, under the drive of environmentally friendly manufacturing, much requirement has been attached to lead-free solder alloys, among which Aubased solder alloy is seen as an excellent filler metal to replace the Pb-based solder alloy used in high-temperature conditions [13,14]. Au-Sn [15], Au-Si [16], Au-Ge [17], Au-Sb [18], and other Au-based low-temperature solders with a melting temperature lower than 400 °C have become the ideal substitute for solder alloys containing high content of lead due to their good wettability, excellent brazing performance, high joint strength, good thermal fatigue resistance, high thermal conductivity, and small dissolution for gold-plated pads [19,20]. In recent years, to meet the temperature requirement of high integrated electronic devices, Aubased medium-temperature solder alloys with the melting temperature of 400-600 °C have received more and more attention, the majority of which are Au-Ag, Au-In, and Au-Ga solder alloys [13,21].…”

Section: Introductionmentioning

confidence: 99%

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Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Au-based Low-temperature Solder Alloysmentioning

confidence: 99%