High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates
Wang Xiaoting,
Jingjing He,
Zhipeng Peng
et al.
Abstract:As an emerging lead-free packaging interconnect material, Nano-Ag paste exhibits superior high-temperature mechanical, electrical, and thermal properties. It can meet the stringent high-temperature and high-density packaging requirements of future high-power semiconductor devices and is garnering widespread attention. However, research on the high-temperature reliability of sintered joints remains rather limited. In this study, we fabricated high-strength hot-press sintered nano-Ag joints using a hot-press sin… Show more
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