“…[10][11][12][13] However, aramid ber is usually incompatible with epoxy resin at the interface and has low surface roughness 14,15 because the molecular structure of aramid usually has an unbranched main chain and lack of active groups, which can make its surface of aramid highly ordered. Therefore, it is necessary to modify aramid in preparing functional aramid ber by physical methods such as coating, 16,17 plasma, 18,19 highenergy rays, 20,21 supercritical uid method, 22 or by chemical methods including copolymerization, 23,24 surface etching, 25 or surface graing. [26][27][28][29] A certain amount of aramid ber is labeled as low-grade in the process of polymerization when the molecular weights of the aramid polymers fail to meet the spinning requirements, which was inuenced by various factors such as raw materials, equipment, or operation technologies.…”