Coherent ePIC Receiver for 64 GBaud QPSK in 0.25 μm Photonic BiCMOS Technology

Gudyriev, Sergiy; Kress, Christian; Zwickel, Heiner; Kemal, J. N.; Lischke, Stefan; Zimmermann, Lars; Koos, C.; Scheytt, J. Christoph

doi:10.1109/jlt.2018.2881107

Cited by 27 publications

(15 citation statements)

References 16 publications

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“…Since silicon (Si) is transparent for the infrared wavelengths, it is commonly used in the telecommunications range. The most popular platform for integrated photonics is silicon-on-insulator (SOI) to leverage the well-established complementary metal oxide semiconductor (CMOS) technology [3], [4]. With silicon photonics, many diverse functionalities can be integrated on a single chip while the use of CMOS electronics adds control to the photonic elements.…”

Section: Introductionmentioning

confidence: 99%

Design and Simulation of Thermo-Optic Phase Shifters With Low Thermal Crosstalk for Dense Photonic Integration

Das

Varshney

et al. 2020

IEEE Access

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We investigate and demonstrate the thermal crosstalk problem in integrated photonic circuits with metal and silicon doped heaters. Further, we illustrate that due to the localized heating effect, integrated doped heaters are out-performed in terms of thermal crosstalk as compared to integrated metal heaters. To mitigate thermal crosstalk and enhance phase tuning efficiency further, a CMOS compatible air-filled trench region is realized between the doped heater and the adjacent element. The performances of three fundamental building blocks of integrated photonic circuits, namely, a PN phase shifter, an optical attenuator, and a ring resonator, are tested by full-wave thermal, charge, and optical simulations. Additionally, the impact of thermal crosstalk on the performance of integrated PN phase shifters and optical attenuators is examined thoroughly. The proposed low crosstalk thermal phase shifters might be very beneficial for densely routed complex integrated photonic circuits like photonic transceivers for data centers, optical phased array antennas, and photonic reservoirs. INDEX TERMS Silicon on insulator (SOI), thermal crosstalk, phase shifter, integrated doped heaters, integrated optical attenuator, thermal switch, ring resonator.

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Section: Introductionmentioning

confidence: 99%

Design and Simulation of Thermo-Optic Phase Shifters With Low Thermal Crosstalk for Dense Photonic Integration

Das

Varshney

et al. 2020

IEEE Access

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“…Given that there can be hundreds or thousands of actuators on the photonic chip, these electronics need to provide sufficient parallel channels. For this discussion, we did not consider technology platforms where the photonics and the electronics are integrated on the same chip [9], [10], [64]. Monolithically integrated photonic-electronic ICs might well provide the most flexible platform to implement programmable PICs, but the cointegration will always require trade-offs: silicon photonic building blocks require different layer thicknesses and much larger feature sizes than deep submicron CMOS nodes.…”

Section: More Than Just Photonsmentioning

confidence: 99%

“…Monolithic co-integration has been demonstrated, but it usually results in a significant performance trade-off between the photonics and the electronics. Except for some specific functions and applications [9], [10], it is often beneficial to fabricate photonics and electronics in separate process flows.…”

mentioning

confidence: 99%

Programmable Photonics: An Opportunity for an Accessible Large-Volume PIC Ecosystem

Bogaerts

Rahim

2020

IEEE J. Select. Topics Quantum Electron.

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We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology.

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“…Measured and simulated performance of designed integrated photonic receiver as well as comparison with the state-of-the art monolithic receivers and TIAs are summarized in Table 1. The integrated optical receivers [35,40] have the highest analog bandwidth of 34 GHz, also they were developed for coherent communication systems (for multiple QAM or QPSK modulation schemes). However, Ref.…”

Section: Optical Receiver With Integrated Photodiode and Transimpedanmentioning

confidence: 99%

“…However, Ref. [40] uses more high-frequency 0.13 µm BiCMOS technology, while in [35], the dissipated power is 208 mW for one channel of the receiver. The photonic receiver [39] has the lowest input-referred noise i n of 11.5 pA/Hz and low P diss , while it uses a more expensive 55 nm technology node.…”

Section: Optical Receiver With Integrated Photodiode and Transimpedanmentioning

confidence: 99%

Microwave Photonic ICs for 25 Gb/s Optical Link Based on SiGe BiCMOS Technology

et al. 2019

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The design, simulation and experimental results of the integrated optical and electronic components for 25 Gb/s microwave photonic link based on a 0.25 µm SiGe:C BiCMOS technology process are presented. A symmetrical depletion-type Mach-Zehnder modulator (MZM) and driver amplifier are intended for electro-optical (E/O) integrated transmitters. The optical divider and combiner of MZM are designed based on the self-imaging theory and then simulated with EM software. In order to verify the correctness of the theory and material properties used in the simulation, a short test (prototype) MZM of 1.9 mm length is produced and measured. It shows an extinction ratio of 19 dB and half-wave voltage-length product of Vπ ∙ L = ~1.5 V·cm. Based on these results, the construction of the segmented modulator with several driver amplifier units is defined. The designed driver amplifier unit provides a bandwidth of more than 30 GHz, saturated output power of 6 dBm (output voltage of Vpp = 1.26 V), and matching better than −15 dB up to 35 GHz; it dissipates 170 mW of power and occupies an area of 0.4 × 0.38 mm2. The optical-electrical (O/E) receiver consists of a Ge-photodiode, transimpedance amplifier (TIA), and passive optical structures that are integrated on a single chip. The measured O/E 3 dB analog bandwidth of the integrated receiver is 22 GHz, and output matching is better than −15 dB up to 30 GHz, which makes the receiver suitable for 25 Gb/s links with intensity modulation. The receiver operates at 1.55 μm wavelength, uses 2.5 V and 3.3 V power supplies, dissipates 160 mW of power, and occupies an area of 1.46 × 0.85 mm2.

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Coherent ePIC Receiver for 64 GBaud QPSK in 0.25 μm Photonic BiCMOS Technology

Cited by 27 publications

References 16 publications

Design and Simulation of Thermo-Optic Phase Shifters With Low Thermal Crosstalk for Dense Photonic Integration

Design and Simulation of Thermo-Optic Phase Shifters With Low Thermal Crosstalk for Dense Photonic Integration

Programmable Photonics: An Opportunity for an Accessible Large-Volume PIC Ecosystem

Microwave Photonic ICs for 25 Gb/s Optical Link Based on SiGe BiCMOS Technology

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