CMOS Imager Technologies for Biomedical Applications

Burghartz, Joachim N.; Engelhardt, Thorsten; Graf, H.-G.; Harendt, Christine; Richter, H.; Scherjon, Cor; Warkentin, Karsten

doi:10.1109/isscc.2008.4523097

Cited by 16 publications

(2 citation statements)

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“…80 UTCs also find application in video endoscopy, smart catheters, diagnostic pills, sub-retinal implants, neural interfaces, 125 swallowable smart pill 126 and tactile functional prosthetics etc. 127,128 In the field of medical diagnosis, UTCs find application as conformal retinal implant for blind vision, electromyographic and/or neural prosthetic implant, and blast sensor patch in sports/military helmets to detect trauma injury. Neurotechnology is another area which will greatly benefit from electronics that bends, stretches and conforms to curved surfaces.…”

Section: Applications Of Utcsmentioning

confidence: 99%

Ultra-thin chips for high-performance flexible electronics

et al. 2018

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Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

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Section: Applications Of Utcsmentioning

confidence: 99%

Ultra-thin chips for high-performance flexible electronics

et al. 2018

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“…The implanted patients were able to perceive coherent structures, coded by an 'electrical image' which was generated by the subretinally implanted electrode array. As reported in Benav et al (2010) the implanted device is based on the monopolar electrode configuration (Burghartz et al, 2008;Rothermel et al, 2008).…”

Section: Introductionmentioning

confidence: 99%