Circuitry in three dimensions: multifunctional molded plastic packages

Frisch, David C.

doi:10.1109/28.81824

Cited by 2 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…An alternative solution for fabricating electronic circuits on curved surfaces is to use three-dimensional molded interconnect devices (3D-MID), which is based on plating technology. [5][6][7][8][9][10][11][12][13][14][15] 3D-MID makes it possible to add electronic functionality on three-dimensional objects without the use of conventional cable wiring, which effectively contributes to producing more attractive products, especially for automotive electronics applications. 3D-MID may lead to reduced total weight compared with conventional wire harnesses and to minimizing the costs of manually assembling the interconnect wiring.…”

Section: Introductionmentioning

confidence: 99%

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

Yoshida

Wada

Izumi

et al. 2017

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

In this work, we demonstrate that highly conductive metal interconnects can be fabricated on the surface of three-dimensional objects using “omnidirectional ink jet” (OIJ) printing technology. OIJ printing technology makes it possible to perform ink jet printing in all directions by combining the motion of a 6-axis vertically articulated robot with precise positioning and a thermal drying process, which allows for the printing of stacked layers. By using OIJ technology, we were the first to successfully fabricate printed interconnect layers having a very low electrical resistance of 12 mΩ over a 10 mm length. Moreover, the results of the high-current test demonstrated that the printed interconnects can withstand high-current-flow of 5 A for 30 min or more.

show abstract

Section: Introductionmentioning

confidence: 99%

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

Yoshida

Wada

Izumi

et al. 2017

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

show abstract

Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

Laine-Ma

Ruuskanen²,

Kortet³

et al. 2009

Circuit World

View full text Add to dashboard Cite

Purpose -The adhesion between electroless copper and a substrate is one of the most important factors in the reliability of thermoplastic printed circuit boards. The purpose of this paper is to investigate the effects of mechanical grinding and acid etching of thermoplastic substrate materials on the adhesion of copper deposited by an electroless copper plating process. The base material of the test substrates was a new high temperature thermoplastic polyphenylene oxide (PPO) compound. Design/methodology/approach -The effects of pre-treatment on plastic surfaces are analyzed by the following methods: Fourier transform infrared (FTIR), SEM, the Dyne surface energy test and the surface roughness test. The adhesion between electroless copper and thermoplastic substrate is measured with a peel strength test. Findings -The results showed that mechanical grinding of the substrates significantly increased adhesion but the highest adhesion is gained by using an acid etch treatment before electroless plating. These results indicated that adhesion between copper and the substrates was not directly proportional to the roughness and surface energy values. Originality/value -The conventional sweller/desmear treatment used in a printed circuit board factory for pre-treating epoxy based laminates prior to electroless plating is not suitable for these PPO compound boards. The copper adhesion is adequate when the substrates are etched with sulphuric acid/ chromate solution. In that case the bonding between the metal layer and the plastic surface is stronger than the bondings between the polymer chains of the thermoplastic material. The adhesion mechanism of electroless copper in these mechanically abraded samples is mechanical interlocking of metal particles.

show abstract

Circuitry in three dimensions: multifunctional molded plastic packages

Cited by 2 publications

References 0 publications

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

Contact Info

Product

Resources

About