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Moulded substrates offer a wide spectrum of performance at economical prices, featuring enhanced electrical, physical and environmental properties. By expanding interconnection into a third dimension by providing connectivity between or along non‐planar surfaces or planes, moulded boards allow designers the freedom to be highly creative in devising circuitry comprising complex shapes or forms of unique sculpture. Opportunities abound for achieving cost reductions, savings being achieved first through eliminating processing steps in PCB fabrication and secondly by simplifying or minimising sub‐assembly or final assembly labour or hardware costs. In addition, further savings can be achieved by incorporating attachment joining techniques like ultrasonic welding. Discussion covers the characteristics of moulded substrates, metallisation of unclad substrates using the additive process, and several applications of moulded circuitry and 3‐D assemblies, before a prediction of the future potential for this technology.

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