Proceedings Electrical Overstress/Electrostatic Discharge Symposium
DOI: 10.1109/eosesd.1996.865158
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Circuit-level simulation of CDM-ESD and EOS in submicron MOS devices

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Cited by 35 publications
(13 citation statements)
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“…In previous results [1][2][3][4][5][6][7], CDM simulation has been used to reconstruct failures in ICs after CDM stress had been applied. The substrate has not been considered for the simulations.…”
Section: Substrate Modelingmentioning
confidence: 99%
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“…In previous results [1][2][3][4][5][6][7], CDM simulation has been used to reconstruct failures in ICs after CDM stress had been applied. The substrate has not been considered for the simulations.…”
Section: Substrate Modelingmentioning
confidence: 99%
“…Most authors put the emphasis on modeling the behavior of ESD protection structures [2][3][4]6], including MOS snapback. Other works focus on simulating the behavior of test circuits and input/output structures during CDM stress [1,5,6] or determination of the behavior of complete ICs [7].…”
Section: Introductionmentioning
confidence: 99%
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“…Transistors exposed to ESD include those used in I/O circuits and active rail clamp circuits. Many ESDrelevant models for MOSFETs may be found in the open literature, e.g., [6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]. The majority of these works treat the body resistance as a single element, in effect representing the device as a single-finger MOSFET.…”
Section: Introductionmentioning
confidence: 99%
“…Hence, research in the past has dealt with the ability to determine the behavior of ICs during CDM discharges with circuit simulation. Several studies investigate CDM behavior on device level [1][2][3][4] and for input circuits and test structures [4][5][6][7]. Addressing chip level simulation of CDM discharges, Lee et al [8] suggest that the probability of gate oxide rupture is correlated with the package capacitance of connected circuit parts.…”
Section: Introductionmentioning
confidence: 99%