Study of CDM specific effects for a smart power input protection structure

Verification of CDM circuit simulation using an ESD evaluation circuit

“…As reported in [7], the arc resistance which occurs when the pogo pin of the CDM tester approaches the package pin influences the discharge behavior. To account for the resulting slightly reduced discharge current and the slower rise time of the discharge current, the arc model developed by Pommerenke and Aidam [13] was implemented in the simulation setup.…”

“…The substrate was neglected for the simulations. In a previous study [7], we demonstrated that accounting for the substrate connection of devices and the substrate resistance can be indispensable for simulating the behavior of an integrated circuit during a CDM discharge correctly. In this work, we studied the influence of parasitic elements, such as interconnect resistance, parasitic capacitances and inductances, and the substrate on the simulation results.…”

“…This reference netlist includes the pad capacitance but does not include a substrate model or interconnect parasitics. The package parasitics [7,10] as well as the CDM tester characteristics [7,11] are accounted for in all simulations. Interconnect and pad capacitances to the CDM tester field charging plate are neglected in this study, which is expected to have only little influence on the simulation results.…”

“…Hence, research in the past has dealt with the ability to determine the behavior of ICs during CDM discharges with circuit simulation. Several studies investigate CDM behavior on device level [1][2][3][4] and for input circuits and test structures [4][5][6][7]. Addressing chip level simulation of CDM discharges, Lee et al [8] suggest that the probability of gate oxide rupture is correlated with the package capacitance of connected circuit parts.…”

“…A previous study [7] demonstrated the importance of taking the substrate into account for achieving correct CDM simulation results. Hence, in contrast to prior chip level CDM simulation studies, the substrate is accounted for in the simulation and the impact of the substrate is confirmed in this work.…”