Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity

Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

“…The Si 2p peak can be de-convoluted into two peaks. The first peak at the binding energy of 100.58 eV, represents the chemical bonding between silicon and carbon ascribed to the silane agent molecules, and the second peak at 101.924 eV could be attributed to the bonding between silicon and oxygen (BAOASi) indicating KH550 and BN are connected through the hydroxyl groups [16]. In summary, the XPS data suggest KH550 can be effectively introduced onto the surface of BN.…”

“…Secondly, the reduction of phonons boundary scattering could play a role in determination of the interfacial resistance. A comparatively consistent idea has been accepted that the mode of thermal conduction in polymer is primarily phonons [1,10,16]. The interfacial resistance is the main factor influencing the diffusing path of phonons between hard particles and soft matrix [16].…”

Thermal Conductivity of Polyurethane Sheets Containing Alumina Nanofibers

“…There are recent reports on the thermal conductivity of polymers filled with BN particles [5][6][7]. Muratov et al have investigated the thermal conductivity of polypropylene/BN particle composites [6].…”

“…Kim et al modified the surfaces of BN particles (12 μm) with surface curing agents and used them to form epoxy/ BN composites. They reported that the surface modification of BN increases the thermal conductivity of the composites (4.11 W/mK at 70 wt% of modified BN particle) [7]. Choi and Kim investigated the thermal conductivity of the epoxy composites with a binary particle of alumina and AN [8].…”

Polymer composites based on hexagonal boron nitride and their application in thermally conductive composites

“…Kim et al 81,84,110 conducted studies on graing silane coupling agents onto the h-BN surface for a high thermal performance. The common strategy was to attach a hydroxyl group onto the h-BN surface by using sodium hydroxide at a high temperature, followed by graing silane coupling agents, such as 3-(glycidoxypropyl)trimethoxysilane, 3-chloropropyltrimethoxysilane, 81,110 and 3-aminopropyltriethoxy silane, 84 to modify the surfaces, which was a smart route to reduce interface thermal resistance.…”