Chemical etching of fused silica after modification with two-pulse bursts of femtosecond laser

Stankevič, Valdemar; Račiukaitis, Gediminas; Gečys, Paulius

doi:10.1364/oe.431306

Cited by 14 publications

(8 citation statements)

References 38 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, the accuracy and sharpness of the structural etching rate of the modified material can be increased. This can be achieved in a few ways, such as by optimizing the etching process, the etching solution [ 36 ], and the laser parameters [ 39 ], or by introducing a specific femtosecond burst regime [ 40 ]. Such improvements can create the possibility of tuning the filter size more accurately.…”

Section: Resultsmentioning

confidence: 99%

Combined Femtosecond Laser Glass Microprocessing for Liver-on-Chip Device Fabrication

Butkutė

Jurkšas²,

Baravykas³

et al. 2023

Materials

View full text Add to dashboard Cite

Nowadays, lab-on-chip (LOC) devices are attracting more and more attention since they show vast prospects for various biomedical applications. Usually, an LOC is a small device that serves a single laboratory function. LOCs show massive potential for organ-on-chip (OOC) device manufacturing since they could allow for research on the avoidance of various diseases or the avoidance of drug testing on animals or humans. However, this technology is still under development. The dominant technique for the fabrication of such devices is molding, which is very attractive and efficient for mass production, but has many drawbacks for prototyping. This article suggests a femtosecond laser microprocessing technique for the prototyping of an OOC-type device—a liver-on-chip. We demonstrate the production of liver-on-chip devices out of glass by using femtosecond laser-based selective laser etching (SLE) and laser welding techniques. The fabricated device was tested with HepG2(GS) liver cancer cells. During the test, HepG2(GS) cells proliferated in the chip, thus showing the potential of the suggested technique for further OOC development.

show abstract

Section: Resultsmentioning

confidence: 99%

Combined Femtosecond Laser Glass Microprocessing for Liver-on-Chip Device Fabrication

Butkutė

Jurkšas²,

Baravykas³

et al. 2023

Materials

View full text Add to dashboard Cite

show abstract

“…In this section, the influence of burst pulse number on the taper of the via is investigated. Bursts pulses can increase the throughput and the etching rate [29]. The number of sub-pulses in different burst envelopes in this experiment is shown in figure 4.…”

Section: Effect Of Burst Pulse Numbermentioning

confidence: 92%

Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology

xu¹,

Fang²,

Zhang³

et al. 2022

J. Micromech. Microeng.

View full text Add to dashboard Cite

Interposers will become more and more important for advanced electronic systems and through substrate vias are essential for the 3-D integration. A straight via is necessary because a tapered hole is accompanied by large signal loss. This article reports a straight through-glass-via (TGV) fabricated by femtosecond laser-assisted chemical etching (FLACE). The femtosecond laser was used to modify the glass substrates, and the modified glass samples were etched with hydrofluoric acid (HF) solution to form TGV. The effects of key processing parameters, including laser pulse energy, the number of burst pulses, and the HF solution concentration, on the TGV taper profile, were systematically investigated. It was found that the TGV taper sidewall angle increased decreased with increasing laser pulse energy and HF solution. And the number of bursts should be optimized because more than 10 bursts would prevent the formation of TGV. The study shows via etched in 3wt% HF after irradiation with 3 bursts of 60 μJ can become approximately vertical. Among the three processing parameters, HF concentration was found to be the most crucial parameter. This work can serve as a critical reference for applications of TGV in high-performance 3D integrated circuits.

show abstract

“…Selectivity values above 1000 could be obtained for fused silica by laser parameter optimization [ 22 ]. Meanwhile, selectivity values above 2000 can be achieved by introducing a particular burst regime [ 26 ] or adding organic solvents to the etchant [ 27 ]. SLE is a perfect technology for high aspect ratio structure fabrication.…”

Section: Introductionmentioning

confidence: 99%

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant

et al. 2022

View full text Add to dashboard Cite

Transparent and high-hardness materials have become the object of wide interest due to their optical and mechanical properties; most notably, concerning technical glasses and crystals. A notable example is sapphire—one of the most rigid materials having impressive mechanical stability, high melting point and a wide transparency window reaching into the UV range, together with impressive laser-induced damage thresholds. Nonetheless, using this material for 3D micro-fabrication is not straightforward due to its brittle nature. On the microscale, selective laser etching (SLE) technology is an appropriate approach for such media. Therefore, we present our research on C-cut crystalline sapphire microprocessing by using femtosecond radiation-induced SLE. Here, we demonstrate a comparison between different wavelength radiation (1030 nm, 515 nm, 343 nm) usage for material modification and various etchants (hydrofluoric acid, sodium hydroxide, potassium hydroxide and sulphuric and phosphoric acid mixture) comparison. Due to the inability to etch crystalline sapphire, regular SLE etchants, such as hydrofluoric acid or potassium hydroxide, have limited adoption in sapphire selective laser etching. Meanwhile, a 78% sulphuric and 22% phosphoric acid mixture at 270 °C temperature is a good alternative for this process. We present the changes in the material after the separate processing steps. After comparing different processing protocols, the perspective is demonstrated for sapphire structure formation.

show abstract

Chemical etching of fused silica after modification with two-pulse bursts of femtosecond laser

Cited by 14 publications

References 38 publications

Combined Femtosecond Laser Glass Microprocessing for Liver-on-Chip Device Fabrication

Combined Femtosecond Laser Glass Microprocessing for Liver-on-Chip Device Fabrication

Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant

Contact Info

Product

Resources

About