Characterization of interconnects resulting from capillary die-to-substrate self-assembly

Mastrangeli, Massimo; Ruythooren, Wouter; Hoof, Chris Van; Célis, Jean-Pierre

doi:10.1109/estc.2008.4684339

Cited by 9 publications

(4 citation statements)

References 14 publications

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“…electroplating to form vertical electrical links from substrate to microcomponents after their capillary self-assembly [29]; whereas Mastrangeli [24], [30] demonstrated how the hydrostatic pressure exerted by residual liquid menisci on capillary self-aligned components can be successfully exploited to establish solder-based interconnections upon thermal reflow, as an alternative to thermo-compression bonding [21]. The use of capillary self-alignment for low-cost and time-efficient assembly of centimetric functional foil dies onto silicon and flexible plastic substrates was demonstrated in our previous work [13].…”

mentioning

confidence: 99%

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

Arutinov

Mastrangeli

Smits

et al. 2015

J. Microelectromech. Syst.

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confidence: 99%

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

Arutinov

Mastrangeli

Smits

et al. 2015

J. Microelectromech. Syst.

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“…As an alternative concept for die placement self-assembly and self-alignment techniques of silicon devices have been proposed, investigated and demonstrated over the past years by various research groups [1][2][3][4]. One approach in selfassembly is the so-called surface programming: a plasma process defines areas of highly selective wettability for specific liquids.…”

Section: Introductionmentioning

confidence: 99%

Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration

Landesberger

Scherbaum

Weber

et al. 2012

2012 4th Electronic System-Integration Technology Conference

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Thin silicon chips with a thickness of 50 m are of light weight and are able to swim on droplets of fluids like for instance water. If the liquid shows a specific wetting behavior with respect to the underlying substrate then droplet and chip can move and self-align. Recent research work was carried out to determine the self-alignment accuracy of 50 m thin silicon dies on plasma programmed surfaces. The self-alignment process sequence for die assembly comprise the following steps: surface programming by CF4 plasma treatment, dispense droplets of water on the metal target areas, pick-up of a 50 m thin chip, move chip tool above the selected target area, let the chip fall down and self-align on the liquid surface on the target area. Within short time the droplet dries off and then the thin die sticks to the substrate. Self-alignment accuracy was measured by infrared microscopy at the position of the alignment marks of top and bottom devices. The paper will report in detai l about sample preparation, selective plasma programming, self-alignment accuracy of thin dies and its dependence of the die size. Furthermore, the chemical composition of the relevant surfaces after CF4 plasma activation were analysed by XPS measurements

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“…Currently, die to die assembly requires new packaging methods able to assemble micro-parts whose sizes are typically around 200µm with a typical accuracy of 1µm and a high throughput. Two ways are usually proposed in micro-assembly: (i) the robotic assembly which consists in handle and assemble the object using microtweezers [2], [3], [4] and (ii) the self-assembly where the object trajectory is driven by long range forces (capillary force or dielectrophoresis force) [5], [6] without adhesion disturbance and with a high throughput. The present paper is focused on the improvement of dielectrophoresis self-assembly.…”

Section: Introductionmentioning

confidence: 99%

Predictive control of a micro bead's trajectory in a dielectrophoresis-based device

Kharboutly¹,

Gauthier²,

Chaillet³

2010

2010 IEEE/RSJ International Conference on Intelligent Robots and Systems

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Micro and nano-particles can be trapped by a non uniform electric field through the effect of the dielectrophoretic force. Dielectrophoresis (DEP) is used to separate, manipulate and sense micro particles in several domains, such as in biological or Carbon Nano-Tubes (CNTs) manipulations. This paper tackles the creation of a closed loop strategy in order to control, using DEP, the trajectory of micro objects using vision feedback. A modeling of the dielectrophoresis force is presented to illustrate the non linearity of the system and the high dynamics of the object under dielectrophoresis . A control strategy based on the generalized predictive control method is proposed with the aim of controlling the trajectory, taking advantage of the high dynamics despite the non linearity. Simulated results are shown to evaluate our control strategy.

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Characterization of interconnects resulting from capillary die-to-substrate self-assembly

Cited by 9 publications

References 14 publications

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration

Predictive control of a micro bead's trajectory in a dielectrophoresis-based device

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