The Photodetector Array Camera and Spectrometer (PACS) is one of the three science instruments on ESA's far infrared and submillimetre observatory. It employs two Ge:Ga photoconductor arrays (stressed and unstressed) with 16 × 25 pixels, each, and two filled silicon bolometer arrays with 16 × 32 and 32 × 64 pixels, respectively, to perform integral-field spectroscopy and imaging photometry in the 60−210 μm wavelength regime. In photometry mode, it simultaneously images two bands, 60−85 μm or 85−125 μm and 125−210 μm, over a field of view of ∼1.75 × 3.5 , with close to Nyquist beam sampling in each band. In spectroscopy mode, it images a field of 47 × 47 , resolved into 5 × 5 pixels, with an instantaneous spectral coverage of ∼ 1500 km s −1 and a spectral resolution of ∼175 km s −1 . We summarise the design of the instrument, describe observing modes, calibration, and data analysis methods, and present our current assessment of the in-orbit performance of the instrument based on the performance verification tests. PACS is fully operational, and the achieved performance is close to or better than the pre-launch predictions. Key words. space vehicles: instruments -instrumentation: photometers -instrumentation: spectrographsHerschel is an ESA space observatory with science instruments provided by European-led Principal Investigator consortia and with important participation from NASA.

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The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed.