2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/R 2016
DOI: 10.1109/nssmic.2016.8069902
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Characterization of fully depleted CMOS active pixel sensors on high resistivity substrates for use in a high radiation environment

Abstract: Abstract-Depleted CMOS active sensors (DMAPS) are being developed for high-energy particle physics experiments in high radiation environments, such as in the ATLAS High Luminosity Large Hadron Collider (HL-LHC). Since charge collection by drift is mandatory for harsh radiation environment, the application of high bias voltage to high resistive sensor material is needed. In this work, a prototype of a DMAPS was fabricated in a 150nm CMOS process on a substrate with a resistivity of >2 kΩ·cm that was thinned to… Show more

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Cited by 13 publications
(21 citation statements)
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“…Its depth can vary from 750 µm to 100 µm after backside processing. The generated strong and uniform electric field ensures high radiation tolerance to Non Ionizing Energy Loss (NIEL) damage and high charge collection efficiency [4,6]. The disadvantage of this implementation is the large sensor capacitance (≈ 300 − 400 f F) that degrades the analog performance in terms of noise and signal rise time, and has to be compensated with increased power consumption.…”
Section: Sensor Implementationmentioning
confidence: 99%
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“…Its depth can vary from 750 µm to 100 µm after backside processing. The generated strong and uniform electric field ensures high radiation tolerance to Non Ionizing Energy Loss (NIEL) damage and high charge collection efficiency [4,6]. The disadvantage of this implementation is the large sensor capacitance (≈ 300 − 400 f F) that degrades the analog performance in terms of noise and signal rise time, and has to be compensated with increased power consumption.…”
Section: Sensor Implementationmentioning
confidence: 99%
“…The LF-Monopix chip [6,7,10] is the successor to CCPD LF and LF-CPIX [4,6] development line in 150 nm LFoundry technology and the first to incorporate a full standalone fast readout. It consists of a 129x36 matrix of pixels with 50x250 µm 2 size, while its total size is 10x9.5 mm 2 .…”
Section: Lf-monopix Chip Designmentioning
confidence: 99%
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“…CMOS pixels with depleted sensing volume, also labelled as depleted monolithic active pixel sensors (DMAPS), can be achieved by exploiting the high-resistivity and/or high-voltage add-ons of modern CMOS technologies. Many such devices have been reported, showing high radiation tolerance towards the requirements of experiments in the High-Luminosity LHC (HL-LHC) era [5][6][7][8]. Moreover, multiple nested wells, available in many commercial CMOS processes, allow to implement full CMOS electronics inside the pixel (see Section 2), and therefore fast readout architectures like hybrid pixels are possible, beyond the rolling shutter readout traditionally used in MAPS.…”
Section: Introductionmentioning
confidence: 99%
“…The CMOS-CSA has the lowest power consumption among the three types. The PMOS-CSA has the largest power consumption, but it has been tested in many previous DMAPS prototypes and is confirmed to have acceptable radiation hardness [4,6]. The NMOS-CSA has a simpler design than the CMOS-CSA and lower power consumption than the PMOS-CSA.…”
Section: Prototypesmentioning
confidence: 99%