Characterization of bump arrays at RF/microwave frequencies

Ndip, Ivan; Sommer, Grit; John, W.; Reichl, H.

doi:10.1016/j.microrel.2004.08.001

Cited by 9 publications

(3 citation statements)

References 5 publications

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“…The interaction between geometry and electrical performance of wire bonds and solder balls have been investigated and reported in numerous publications (e.g. [12]) owing to their wide utilisation since decades. But there is minimum published information about electrical performance of e.g.…”

Section: Discussionmentioning

confidence: 99%

“…In [18], 2.5D SiP-Solutions have been subdivided in four groups, in accordance with their capability to connect/redistribute signals and nets in the vertical or lateral wiring passage (Fig.3 [12,13] Parameter's Set Considering the net complexity schema and being supported by essential parameters which are partly presented in Table 3, a SiP designer at the beginning of the detailed layout/implementation stage can choose between four technology groups and start optimizing results of global layout targeting the chosen technology.…”

Section: Fig 2 Global Layout -Components and Nets: A) On The Beginnmentioning

confidence: 99%

“…12) l min -minimal distance between first pad raw and die, p c -pad pitch on chip, a -dimension of square chip's side.…”

mentioning

confidence: 99%

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Integration technology parameters for physical design of vertical system-in-package

Polityko

Guttowski²,

Reichl³

2006

56th Electronic Components and Technology Conference 2006

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A promising solution for achieving highest integration density has been seen in vertical integration of heterogeneous components as a System-in-Package (SiP). An important success factor of 2.5/3D SiP is efficiency in physical design. The main content of this article is an introduction to the structuring of physical design, novel classification of 2.5D technologies, and the calculation of a parameter set, which provides key data for an objective comparison and selection of integration technologies for the design process of vertical integrated SiP.

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Section: Discussionmentioning

confidence: 99%

Section: Fig 2 Global Layout -Components and Nets: A) On The Beginnmentioning

confidence: 99%

See 1 more Smart Citation

Integration technology parameters for physical design of vertical system-in-package

Polityko

Guttowski²,

Reichl³

2006

56th Electronic Components and Technology Conference 2006

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Functionality-power-packaging considerations in context aware wearable systems

Bharatula

Lukowicz

Tröster

2006

Pers Ubiquit Comput

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Wearable computing places tighter constraints on architecture design than traditional mobile computing. The architecture is described in terms of miniaturization, power-awareness, global low-power design and suitability for an application. In this article we present a new methodology based on three different system properties. Functionality, power and electronic Packaging metrics are proposed and evaluated to study different trade offs. We analyze the trade offs in different context recognition scenarios. The proof of concept case study is analyzed by studying (a) interaction with household appliances by a wrist worn device (acceleration, light sensors) (b) studying walking behavior with acceleration sensors, (c) computational task and (d) gesture recognition in a wood-workshop using the combination of accelerometer and microphone sensors. After analyzing the case study, we highlight the size aspect by electronic packaging for a given functionality and present the miniaturization trends for 'autonomous sensor button'.Keywords Wearable computing Á Context recognition Á Gesture Á Electronic packaging Á Functionality Á Miniaturization Context aware wearable systemsWearable computing as defined by [1, 2] envisions personal, mobile computing systems that are always on, useful in all situations and most of all, easy to use. Thus whereas a conventional mobile device would only be used for an occasional schedule check or address lookup, a wearable device would constantly provide the user with useful information such as nearby shops and special offers, transport delays, or health and lifestyle-related reminders (taking medicine, diet etc). Such systems are particularly important in professional applications such as emergency response units, manufacturing and maintenance. Thus a wearable system might constantly provide a fireman with hints and warning about hazards related to his environment, his physiological state and his current actions.A key component of the wearable computing vision is the ability of the system to model and recognize user activity and the situation around him. This so called context awareness [3] allows the system to proactively provide the user with the right information at the right time, reduces the complexity of the user interface, and allows new modes of information recording. One of the most popular approaches to context awareness in a mobile environment is based on simple on-body sensors. Thus an accelerometer, light sensor and a microphone placed on the wrist could be used to track interaction with household appliances [4] or the use of tools [5]. In a similar way an accelerometer and/or gyroscope on the upper leg can differentiate between level walking, going upstairs, going downstairs and running.

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Systematic design and optimization of bond wire antennas using the M3-approach

Ndip

Guttowski

Reichl

et al. 2012

2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

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In this paper, all the three steps required for implementing the M3-approach are illustrated for bond wire antennas. First, a methodology for efficient and accurate electromagnetic modeling of bond wire antennas, based on parameterized models of the shape and length of bond wires, is developed. The resulting model is experimentally verified and applied to extensively study the RF performance of bond wire antennas. Based on these studies, reliable design measures are derived

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Characterization of bump arrays at RF/microwave frequencies

Cited by 9 publications

References 5 publications

Integration technology parameters for physical design of vertical system-in-package

Integration technology parameters for physical design of vertical system-in-package

Functionality-power-packaging considerations in context aware wearable systems

Systematic design and optimization of bond wire antennas using the M3-approach

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