Systematic design and optimization of bond wire antennas using the M3-approach

Abstract

In this paper, all the three steps required for implementing the M3-approach are illustrated for bond wire antennas. First, a methodology for efficient and accurate electromagnetic modeling of bond wire antennas, based on parameterized models of the shape and length of bond wires, is developed. The resulting model is experimentally verified and applied to extensively study the RF performance of bond wire antennas. Based on these studies, reliable design measures are derived

Experimental verification and analysis of analytical model of the shape of bond wire antennas

“…1, was first developed by implementing (1) in High Frequency Structure Simulator (HFSS), a full‐wave electromagnetic field solver from Ansys. To obtain the length of the wire () required for resonance, the analytical model in (2) [6, 7], derived from (1) was applied where Similarly to (1), the model for in (2) is also dependent on the wire bonding and design parameters. To achieve resonance at ∼55 GHz using a 25 µm thick wire, the following bonding parameters were used: , and .…”

“…However, since no mathematical function is available to describe the shape of JEDEC bond wire models, they are predominantly used in combination with electromagnetic field solvers. To overcome the limitations of the semi‐circular loop and JEDEC models, Ndip et al derived a BWA model, based on the Gaussian function, which represents the realistic shape of bond wires [6, 7]. To the best of the authors’ knowledge, the model proposed by Ndip et al , and given in (1), is the only model in published literature that captures the realistic shape of BWAs in dependence on their bonding and design parameters where is the slope constant, represents the maximum loop height of the wire, is the distance between the bonding positions ( u and v ), and is the thickness of the pad metallisation on which the wire is bonded.…”

Unconventional applications of wire bonding create opportunities for microsystem integration

“…Chen et al [103] report on a CMOS integrated 43 GHz inter-chip data link with a 6 Gb/s data rate over 4 cm. Ndip et al [104,105] propose novel 3D electromagnetic models of bond wire antennas in order to study their radiation characteristics as well as the impact of process tolerances on the performance of bond wire antennas. Chen et al [106] form minimal inductances from a straight segment of a bond wire in an integrated contactless RF switch and tunable filter arrangement.…”