1999
DOI: 10.1143/jjap.38.7031
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Characteristic Variation of Exposure Pattern in Cell-Projection Electron-Beam Lithography

Abstract: The characteristic variation of an exposure pattern with various optical parameters is calculated in a typical cell-projection lithography system by using an electron trajectory simulation. The Coulomb interaction effect among electrons in the beam is calculated which determines the pattern blur at the wafer surface. The acceleration voltage is 50 kV, the exposure pattern is a series of line and space, and the field size is 5 µm×5 µm. As the beam current density varies from 2 to 13 A/cm2 a… Show more

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Cited by 7 publications
(1 citation statement)
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“…], a solid line shown as "Full beam" is obtained. by simulating all electrons existent in the beam by the ordinary Monte Carlo simulation, [5] "NN" is obtained by considering the Coulomb force between only the nearest-neighbor electrons as the stochastic Coulomb effect, "Field" is obtained by considering the beam forms a potential distribution as the global Coulomb effect, and "NN+Field" is the present result, which considers both the global and the stochastic Coulomb effects. The result of "N'' shows a short tail at the radius of 200pn1, and a small blur is found from the original beam.…”
mentioning
confidence: 99%
“…], a solid line shown as "Full beam" is obtained. by simulating all electrons existent in the beam by the ordinary Monte Carlo simulation, [5] "NN" is obtained by considering the Coulomb force between only the nearest-neighbor electrons as the stochastic Coulomb effect, "Field" is obtained by considering the beam forms a potential distribution as the global Coulomb effect, and "NN+Field" is the present result, which considers both the global and the stochastic Coulomb effects. The result of "N'' shows a short tail at the radius of 200pn1, and a small blur is found from the original beam.…”
mentioning
confidence: 99%