Characterisation of electroless nickel plated titanium powder

Abstract

In this study, pure titanium powder with an average size of 20 mm was treated by electroless nickel plating to obtain titanium-nickel composite/duplex powder. Two plating procedures were applied; continuous short period (CSP) and discontinuous long period (DLP) processes. The plated titanium powder particles as well as unplated ones were characterised by energy dispersive spectrometry (EDS), scanning electron microscopy (SEM), particle size analysis and X-ray mapping analysis methods. The nickel plated titanium powder was sprayed on the steel substrate by atmospheric plasma spray technique. Furthermore, the mixed titanium-nickel powder was also sprayed. The morphology of sprayed powders was compared with each other. It was found that nickel forms fine dispersed nodules on the surface of titanium powder particles in the CSP process, whereas it appeared as homogeneous layers on the surface of all the particles in the DLP process. Also, it was found that the mass deposited on the powder increased with the plating period. The sprayed nickel plated powder showed better microstructure than the sprayed nickel mixed one.

Quantum mechanical approach for electroless plating process

“…15,16 In the case of DPhTU (Figs. [6][7][8], HOMO and LUMO were effectively localised on one of the phenyl moiety, whereas another phenyl ring is partly confined with HOMO and LUMO. This indicates that DPhTU has not effectively adsorbed on the metal surface and in turn diminished the acceleration of electroless deposition.…”

“…As pointed out by Han and Fang 1 and others, [2][3][4] sulphur bearing organic compounds such as cystein, thioglycolic acid and some thiourea derivatives were reported as accelerators for electroless plating process. [5][6][7][8] However, there has been no published report on the acceleration effect of p-tolyl thiourea (p-TLTU) and diphenyl thiourea (DPhTU) on electroless nickel plating. This paper explains the influence of p-TLTU and DPhTU on the rate of electroless nickel plating and energy of activation.…”

KMnO4‐system etching process and electroless nickel plating on ABS

“…The electroless plating process is widely used in industries because the process only requires simple equipment and provides convenient operation . And acrylonitrile butadiene styrene (ABS) resin is a kind of terpolymer that is the most common plateable plastic with high intensity and toughness .…”

“…The electroless plating process is widely used in industries because the process only requires simple equipment and provides convenient operation. [1][2][3][4][5][6] And acrylonitrile butadiene styrene (ABS) resin is a kind of terpolymer that is the most common plateable plastic with high intensity and toughness. [7,8] As a result, nickel-plated ABS is used in almost all decorative plating processes, and these products are used in many areas, such as office equipment, automotive and plane parts, and other industrial usages.…”

Iron(II) acetylacetonate containing brightener and sulphur containing carrier in nickel plating

“…19 Moreover, to improve the features of nickel plating surface, Abdeli et al performed Ni-B-Ti coating. 20 In electroless plating, except of improving of surface features, required features should be ensured possible minimum cost.…”