KMnO₄‐system etching process and electroless nickel plating on ABS

Abstract

Etching treatment for acrylonitrile butadiene styrene (ABS) resin and electroless nickel plating process have been studied. The ABS first was etched in a chromium‐free potassium permanganate etching system with different etching times. Scanning electron microscope (SEM), Fourier transform infrared spectroscopy (FT‐IR), and hydrophilicity test showed that the ABS is of moderate and homogeneous hole size after being etched at a temperature of 65 °C with 6 g L−1 potassium permanganate for 20 min. Then electroless nickel process was performed by immersing the ABS into in a Ni plating bath at 45 °C for 20 min at a pH of 8.5–9.5. The coating was even, dense, and reveals good corrosion resistance. In addition, the nickel plating adhesion strength reached 2.73 MPa. Therefore, the excellent performance of the KMnO4‐H2SO4‐H3PO4‐H2O etching system may replace the traditional chromic anhydride‐sulfuric acid etching system as an environmentally friendly process.

New Dissimilar Joining Method of CFRP/A6061 Al by Cu Electrodeposition

“…The CFRP samples were etched by immersion in a solution containing 0.2 M KMnO 4 + 4 M NaOH at 373 K for 45 min. 15) After the etching, the samples were sulfonated by immersion in a solution containing 14 M H 2 SO 4 at 333 K for 10 min.…”

A comprehensive review on surface modifications of polymer‐based 3D‐printed structures: Metal coating prospects and challenges

“…This method had potential applications in composite material synthesis and intermediate pattern fabrication, although further research was necessary to enhance adhesion between substrates and coatings. In a study, 89 ABS substrate was etched for nickel electroless plating process using a chromium‐free potassium permanganate (KMnO 4 ) solution, resulting in consistent and moderate hole sizes at a temperature of 65°C using a solution of 6 g/L potassium permanganate for a duration of 20 min. Subsequently, electroless nickel plating took place at a temperature of 45°C and a pH range of 8.5–9.5.…”

“…According to kinetic studies, it was possible to obtain a Ni thickness of around 2 μm in 2 h. Additionally, a proof-of-concept experiment showed that Ni-coated polymer sheets may be electroplated with a variety of metals, including copper (Cu), to achieve a thickness of approximately 15 μm in just 1 h of electrodeposition. This method had potential applications in composite material synthesis and intermediate pattern fabrication, although further research was necessary to enhance adhesion between substrates and coatings.In a study,89 ABS substrate was etched for nickel electroless plating process using a chromium-free potassium permanganate (KMnO 4 ) solution, resulting in consistent and moderate hole sizes at a temperature of 65 C using a solution of 6 g/L potassium permanganate for a duration of 20 min. Subsequently, electroless nickel plating took place at a temperature of 45 C and a pH range of 8.5-9.5.…”

Effect of Swelling of Chemical Reagents and the Sulfuric-Chromic Acid Bath on Surface Texturizing of Poly(Acrylonitrile-Butadiene-Styrene)

“…In the last decade, there have been a very intensive quest for improving the etching treatment for ABS especially for copper and nickel plating. 19,21,22 There are many different alternatives proposed in these studies and all of them with the same target, avoid the use of Cr 6+ in metallization of ABS and other polymers. 22 The studies focused in substituting the sulfuric-chromic acid bath, and among many different procedures, the use of KMnO 4 have been one of the more important points of reference.…”

“…22 The studies focused in substituting the sulfuric-chromic acid bath, and among many different procedures, the use of KMnO 4 have been one of the more important points of reference. 21,23 Nowadays, the swelling of substances into polymers are mainly used in hydrogels for making of them superabsorbent composites 24 and conferring them some characteristics by the swelling of substances such as ionic, 25,26 anti-microbial, 27 fuels, 28 fertilizers. 29 There are other works focused in the humidity absorption into polymers.…”