Ceramic joining III bonding of alumina via Cu/Nb/Cu interlayers

Shalz, M. L.; Dalgleish, B.J.; Tomsia, Antoni P.; Cannon, R. M.; Glaeser, Andreas M.

doi:10.1007/bf00357335

Cited by 50 publications

(84 citation statements)

References 37 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Post-bonding anneals were conducted to explore the effects of temperature and environment on joint stability. Many of the materials and experimental procedures used in this work duplicate those used previously [20,77].…”

Section: Methodsmentioning

confidence: 99%

“…Most studies of the wetting behavior of "pure" copper on alumina or sapphire indicate obtuse contact angles varying between 110° and 170° [20,22,55,[58][59][60][61][62][63][64], with more limited evidence suggesting that the contact angle decreases slightly with increasing temperature [59,62,63]. The copper-oxygen phase 8 Morozumi et al [27] report ≈50% bonded area after 1 h, 8.8 MPa, hv bonding at 1600°C.…”

Section: Brazing Using Copper-cuprous Oxide Eutectic and Joint Propermentioning

confidence: 99%

“…The copper-coated substrates were left in the vacuum deposition chamber until the niobium core layer was cleaned and ready for sample assembly. Film thickness measurements were performed on glass cover slips placed into the chamber during deposition using both step height (profilometry) and weight gain measurements as described previously [20]. The film thickness varies somewhat from sample to sample and with position on a substrate surface.…”

Section: Coating Proceduresmentioning

confidence: 99%

“…Joining methods utilizing multilayer metallic interlayers under conditions where a thin or partial layer of a transient liquid phase forms were also proposed [17,18]. The partial transient liquid phase (ptlp) method has been used to join oxide [18][19][20][21][22][23] and nonoxide ceramics [21][22][23][24][25][26].…”

Section: Introductionmentioning

confidence: 99%

“…Prior work exploring the use of multilayer copper/niobium/copper interlayers for the joining of alumina [20] demonstrated that strong joints could be produced at 1150°C, well below the temperatures normally used for solid-state diffusion bonding of niobium to alumina. The limited solubility and slow diffusion of copper in niobium prevented disappearance of the liquid phase at the joining temperature.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

View full text Add to dashboard Cite

Alumina has been joined at 1150°C and 1400°C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (≈240 ± 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800°C-1100°C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Postbonding anneals at 1000°C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface. Cu/Nb/Cu Interlayers R. A. Marks et al. Joining of Alumina via

show abstract

Section: Methodsmentioning

confidence: 99%

Section: Brazing Using Copper-cuprous Oxide Eutectic and Joint Propermentioning

confidence: 99%

Section: Coating Proceduresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

View full text Add to dashboard Cite

show abstract

Engineering High‐Quality Ceramic‐Metal Bonds

Greenhut

Chapman

2006

Advances in Joining of Ceramics

View full text Add to dashboard Cite

Wettability of Cu-Based Alloys on Alumina and Joining of Alumina with Microdesigned Nickel-Chromium Alloy Interlayer

Nakashima

Mori

Glaeser

1998

Ceramic Microstructures

Self Cite

View full text Add to dashboard Cite

INTRODUCTIONMonolithic ceramic materials are being widely developed for a variety of applications ranging from use as strucrural components to high-performance electronic substrates. Recently, however, major efforts have been made to use ceramics in structural applications under severe operating conditions. Joining of ceramics to ceramics and to metals is considered one of the key technologies that will either expand or restrict the potential use of ceramic materials in a wide range of applications, such as heat engines, heat exchangers and recuperato rs.Recent work by some of the authors 1 ·3 and Y. Iino4 has explored the PTLP (Partial Transienc Liquid-Phase) method of ceramic-ceramic joining. PTLP bonding is a joining method that seeks to combine the most attractive features of diffusion bonding and brazing. The technique employs a multilayer, initially inhomogeneous incerlayer. These microdesigned multilayer interlayer structures form a thin layer of a transient liquid phase (TLP) at relatively low temperatures to facilitate joining with refractory metal-based interlayers. Ar the temperature of PTLP bonding, diffusion of the less refractory cladding metal into rhe refractory core metal, reaction of the less refractory cladding metal with the refractory core metal, or a combination of these processes can lead to the disappearance of the liquid. This approach allows the formation of bonds at relatively low temperature, and interdiffusion and resulting homogenization during bonding forms a more refractory interlayer that offers the potential for high temperature use.In the case of such multilayer interlayers in PTLP bonding, the transient liquid phase is sandwiched between a ceramic and a refractory core metal. The contact angles of a liquid metal on a ceramic are high, and those on a core metal are typically quite low. A necessary condition for favorable redistribution of the liquid along the interface is that the sum of these two contact angles be less than 180°. Modifications to the transient liquid phase chemistry that reduce the contact angle on a ceramic are an important factor when modifying the process to improve strength characteristics. Such modifications can arise due to dissolution of the refractory core metal into the transient liquid film during PTLP bonding, in an effort to 407 establish local equilibrium between the liquid phase and the core layer. An understanding of the effect of the associated changes in liquid film chemistry on its wetting behavior is crucial to successful ceramic-metal joining.The present paper describes the effect of additions (Cr, Ni and 80Ni·20Cr) on the wetting characteristics of liquid Cu on Al203, and the study of PTLP (Partial Transient Liquid-Phase) bonding of Al203 using microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers. EXPERIMENTAL PROCEDURES MaterialsTwo kinds of polycrystalline alumina, 99.5% and 99.9% pure (SSA-S and SSA-999W, "'98% dense; Nikkato Co. Ltd.), were used in this study. The 99.5% pure Al203 contains a small amount of glassy phase. The material wa...

show abstract

Ceramic joining III bonding of alumina via Cu/Nb/Cu interlayers

Cited by 50 publications

References 37 publications

Joining of alumina via copper/niobium/copper interlayers

Joining of alumina via copper/niobium/copper interlayers

Engineering High‐Quality Ceramic‐Metal Bonds

Wettability of Cu-Based Alloys on Alumina and Joining of Alumina with Microdesigned Nickel-Chromium Alloy Interlayer

Contact Info

Product

Resources

About