Ceramic &amp;#x2014; Ceramic joining using glass frit for high temperature application

Zhang, Lim Jun; Sharif, Ahmed; Yeung, Ho Beng; Rong, Eric Phua Jian; Made, Riko I; Long, Lau Fu; Dy, Lim Ju; Cheong, Wai Chye

doi:10.1109/eptc.2012.6507047

Cited by 3 publications

(1 citation statement)

References 15 publications

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“…Therefore, the thermal conditioning process has to be investigated to reduce the bonding defects and increase the bonding strength. Since the melting process of glass [15] and the total heat flux [16][17][18] will affect the formation of voids, we have experimentally developed an optimized bonding process to remove bubbles/voids in the glass frit as illustrated in figure 6. The black line is the original bonding process flow and the red line is the new process flow.…”

Section: The Optimized Thermal Conditioning Profilementioning

confidence: 99%

Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

Liu

Chen

Liu

et al. 2016

J. Micromech. Microeng.

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A simple and versatile two-step silicon wet etching technique for the control of the width and height of the glass frit bonding layer has been developed to improve bonding strength and reliability in wafer-level microelectromechanical systems (MEMS) packaging processes. The height of the glass frit bonding layer is set by the design of a vertical reference wall which regulates the distance between the silicon wafer and the encapsulation capping substrate. On the other hand, the width of the bonding layer is constrained between two micro grooves which are used to accommodate the spillages of extra glass frit during the bonding process. An optimized thermal bonding process, including the formation of glass liquid, removal of gas bubbles under vacuum and the filling of voids under normal atmospheric condition has been developed to suppress the formation of the bubbles/voids. The stencil printing and pre-sintering processes for the glass frit have been characterized before the thermal bonding process under different magnitudes of bonding pressure. The bonding gap thickness is found to be equal to the height of the reference wall of 10 μm in the prototype design. The bubbles/ voids are found to be suppressed effectively and the bonding strength increases from 10.2 to 19.1 MPa as compared with a conventional thermal annealing process in air. Experimentally, prototype samples are measured to have passed the high hermetic sealing leakage tests of 5 × 10 −8 atm cc s −1 .

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Section: The Optimized Thermal Conditioning Profilementioning

confidence: 99%

Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

Liu

Chen

Liu

et al. 2016

J. Micromech. Microeng.

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Study on the effect of laser pre-sintering in laser-assisted glass frit bonding

Zhong

Chen

Shaoxiang

et al. 2022

Journal of Materials Research and Technology

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Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

Köhler

Farina

Schulz

et al. 2022

J. Sens. Sens. Syst.

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Abstract. A sensor based on a piezoelectric single crystal enables operation even under harsh environmental conditions. In addition to the sensor element, the packaging technology is crucial for sensor performance. In this paper, a suitable assembly and interconnection technology concept of Ca3TaGa3Si2O14 (CTGS) resonators for high-temperature applications is presented as a platform for future sensor assemblies. The concept described here has already been functionally tested as a temperature sensor (Schulz et al., 2021). The concept includes a sapphire base plate, a housing lid, and a spacer made from aluminium oxide (Al2O3). The substrate is metallised with platinum manufactured into thin film and thick film technology. The ceramic components are fused with glass solder. The connection of the resonator to the conductive tracks is realised by thermosonic bonding with 25 µm platinum wire. Initially, the stability of the metallisation must be investigated before subsequent electrical testing under high temperature. Diffusion processes play a major role in this temperature range, and the stability of the layer is a necessary condition for subsequent investigations. A suitable set of bonding parameters and the strength of the platinum bonds prior to and after thermal load is analysed. Shear tests are used to evaluate the quality of the ceramic materials fused with glass solder after thermal ageing. The dielectrical properties of sapphire and glass solder such as the isolation resistance, the relative permittivity, and the loss factor at high temperatures are evaluated using interdigital structures. The loss factor is measured on both bare interdigital structures and the samples coated with glass solder to make an estimation about the conductive behaviour up to 1000 ∘C. A ceramic lid for the sensor housing is attached by a high-temperature stable glass solder. Since platinum conductors are fed through this glass solder connection, the electrical conductivity of the glass solder is characterised at high temperature. Furthermore, the hermeticity of the assemblies is verified by means of helium leakage tests. These investigations are the basis for the implementation of an assembly and interconnection technology that is suitable for reliable operation under extreme temperature conditions. The packaging technology also offers further possibilities for pressure or chemical sensors that can withstand high-temperature loads.

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Ceramic — Ceramic joining using glass frit for high temperature application

Cited by 3 publications

References 15 publications

Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

Study on the effect of laser pre-sintering in laser-assisted glass frit bonding

Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

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