2012
DOI: 10.1109/ted.2012.2190365
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Capacitance and $S$-Parameter Techniques for Dielectric Characterization With Application to High-$k$ PMNT Thin-Film Layers

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Cited by 9 publications
(10 citation statements)
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“…In this case, the admittance in Fig. 2(b) can be written as (1) where the real part of this admittance can be rearranged as (2) In accordance to (2), when obtaining from measured can be determined from the intercept with the ordinates of the linear regression of the versus curve, whereas , where is the slope of this regression. Bear in mind that this regression has to be performed at so low that the effect of on is negligible and thus the experimental data present linearity.…”
Section: Methods Formulationmentioning
confidence: 99%
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“…In this case, the admittance in Fig. 2(b) can be written as (1) where the real part of this admittance can be rearranged as (2) In accordance to (2), when obtaining from measured can be determined from the intercept with the ordinates of the linear regression of the versus curve, whereas , where is the slope of this regression. Bear in mind that this regression has to be performed at so low that the effect of on is negligible and thus the experimental data present linearity.…”
Section: Methods Formulationmentioning
confidence: 99%
“…In this regard, it is necessary to know the parameters used as figures-of-merit for dielectrics: the relative permittivity and the loss tangent . Furthermore, obtaining these parameters from prototypes presenting a thickness comparable to those used in practical applications allows to include the impact of effects such as leakage currents [2], resulting in a more accurate characterization of the dielectric under normal operation conditions.…”
Section: Introductionmentioning
confidence: 99%
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“…) topology is commonly used in order to characterize thin films, [1]- [4]. However, at high frequencies or in the case of a high permittivity, propagation phenomena reduce the apparent permittivity.…”
Section: Mim (Metal Insulatormentioning
confidence: 99%