Broad-band high-power amplifier using spatial power-combining technique

Abstract

High power, broad bandwidth, high linearity, and low noise are among the most important features in amplifier design. The broad-band spatial power-combining technique addresses all these issues by combining the output power of a large quantity of microwave monolithic integrated circuit (MMIC) amplifiers in a broad-band coaxial waveguide environment, while maintaining good linearity and improving phase noise of the MMIC amplifiers. A coaxial waveguide was used as the host of the combining circuits for broader bandwidth and better uniformity by equally distributing the input power to each element. A new compact coaxial combiner with much smaller size is investigated. Broad-band slotline to microstrip-line transition is integrated for better compatibility with commercial MMIC amplifiers. Thermal simulations are performed and an improved thermal management scheme over previous designs is employed to improve the heat sinking in high-power application. A high-power amplifier using the compact combiner design is built and demonstrated to have a bandwidth from 6 to 17 GHz with 44-W maximum output power. Linearity measurement has shown a high third-order intercept point of 52 dBm. Analysis shows the amplifier has the ability to extend spurious-free dynamic range by 2 3 times. The amplifier also has shown a residual phase floor close to 140 dBc at 10-kHz offset from the carrier with 5-6-dB reductions compared to a single MMIC amplifier it integrates.

Ultrawideband LNA 1960–2019: Review

“…It also indicates the possibility of implementing several diodes [140,149,333] or onchip transformer [98,166,171,189,210,223,230,238,243,256,273,284,305,308,309,315,317,319,321,325,330,332,358] in RFICs. Moreover, the validity and reliability of ADS simulations in the RF region were confirmed by the previous works [50,52,54,56,57,59,61,71,102,114,164,165,169,183,188,203,207,223,224,229,230,243,246,…”