Bright nickel plating from nickel citrate electroplating baths

Doi, Tadashi; Mizumoto, Kazunari; Tanaka, Shin‐ichi; Yamashita, Tsugito

doi:10.1016/s0026-0576(04)90236-x

Cited by 29 publications

(13 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Doi et. al. reported that a plating bath containing citric acid is effective in obtaining fine crystalline Ni films free of texture effects by plating [5,6]. It is well known that fine crystal structures are effective in realizing good soft magnetic properties due to the exchange softening effect [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Soft Magnetic Properties of Electrodeposited Fe-Ni Films Prepared in Citric Acid Based Bath

et al. 2012

View full text Add to dashboard Cite

Electrodeposited Fe-Ni films are widely used in device applications. However, there is a growing awareness of the toxicity of the plating bath containing boric acid. In order to avoid boric acid in the deposition process, we have employed a citric acid based bath for electrodeposition of Fe-Ni films and investigated the effect of the acid content in the bath on the structural and magnetic properties of the deposited films. It is found that the Fe content of the film depends largely on the acid concentration and low coercivity values of less than 30 A/m are realized when the Fe content of the film is around 22 at.%. This magnetic softness is attainable in a wide film thickness range between 20 and 120 µm. Our process exhibits a relatively high cathode efficiency of above 55 %. Furthermore, a high deposition rate of 170 µm/h is obtained without sacrificing the magnetic softness of the film by increasing the current density during the deposition. From these results, we conclude that the citric acid based bath is an environmentally friendlier plating bath ideal for mass-production of magnetically soft Fe-Ni films.

show abstract

Section: Introductionmentioning

confidence: 99%

Soft Magnetic Properties of Electrodeposited Fe-Ni Films Prepared in Citric Acid Based Bath

et al. 2012

View full text Add to dashboard Cite

show abstract

“…Karakteristik depositsangat bervariasi tergantung pada apakah pencerah ditambahkan ke salah satu perendamanan sitrat atau Watts dan pengujian kinerja pelevelan dari brighteners dievaluasi dengan mengukur kekasaran permukaan spesimen yang digunakan untuk pengukuran kekerasan: difraktometri sinar-X, analisis fluoresensi sinar-X.Dan pengamatan penampang endapan disiapkan dengan menggunakan katoda cakram tembaga melingkar (area 0,2-dm 2 ) sebagai substrat [12]. Electroplating untuk deposisi nikel menggunakan jalur elektrolitik.…”

Section: Pengembangan Pelapisan Logamunclassified

Studi Literatur Faktor-Faktor Pengaruh Pada Pelapisan Nikel Dan Perkembangannya

Permana

Zamrudy

2023

Distilat: J. Tekn. Sep

View full text Add to dashboard Cite

Tujuan studi literatur ini untuk mengetahui hasil kinerja dari Pelapisan logam nikel menggunakan metode electroplatingbeberapa tahun terakhir ini banyak dikembangkan.Ada banyak alasantuntutan efisiensi bahan,waktu dan biaya, tentunya pengembangan metode terus di lakukan untuk melapisi objek, diantaramya termasuk pengendalian korosi, ketahanan terhadap keausan dan tujuan dekoratif. Dalam konteks ini, salah satu rujukan metode yang sering disarankan untuk kebutuhan maintenence akibat korosi dan kebutuhann estetika, dengan perhatian khusus pada logam individu serta pelapis Ni yang dibuat dengan cara elektrodeposisi. Dalam studi literatur iniakan dilihat bagaimana faktor-faktor yang berpengaruh terhadap deposisi dalam kondisi optimal dan metode pengembangan electroplating juga dibahas pada makalah ini.

show abstract

“…Additives used in the electroplating were DOW Chemical's CP-360, which allows high current density plating (~10 ASD). For this experiment, Haring cell bath, VCP (Vertical Continuous Plating), and the equipments designed to reduce plating thickness variation with optimized distance between anode and cathode (plating specimen) were used [6,7]. Dry film used in the Photo-Lithography process was HM-40 series by Hitachi, Japan.…”

Section: Cu Pillar Electroplating Technologymentioning

confidence: 99%

Improvement of Cu-Pillar Structure Using Advanced Plating Method

Park¹,

Kim²,

Noh³

et al. 2017

JMSE-B

View full text Add to dashboard Cite

The recent appearance of mobile application processor now plays an important role in the semiconductor industry. Additionally, there have been endless demands for small form factor, thin profile, outstanding thermal, mechanical properties and electrical performances in the field of IC packages for mobile application processors. MIS (Molded Interconnect Substrate) can provide ideal and this solution in the mobile industry as it contains multiple solutions for the complicated requirement of the IC packages for application processors. Based on the embedded pattern technology, this solution can provide high I/O count, fine pattern for small form factor, and stable flip chip mounting methods. Other advantages of this solution include stable properties required for high-frequency transmission and high thermal dissipation rate as it is only composed of copper and epoxy mold compound materials. These core techniques for MIS technology can be divided into below major concepts. First, Cu pillar electrolytic plating technology electrically connects the inner and the outer layers using photo-lithography method, instead of laser method. The shape of Cu pillar and the plating thickness tolerance control are the key parameters. Second, grinding technology is to precisely grind the plated Cu pillars and applied mold epoxy. And deposition of Cu layer on top of grinded mold surface can construct fine pattern traces.

show abstract

Bright nickel plating from nickel citrate electroplating baths

Cited by 29 publications

References 3 publications

Soft Magnetic Properties of Electrodeposited Fe-Ni Films Prepared in Citric Acid Based Bath

Soft Magnetic Properties of Electrodeposited Fe-Ni Films Prepared in Citric Acid Based Bath

Studi Literatur Faktor-Faktor Pengaruh Pada Pelapisan Nikel Dan Perkembangannya

Improvement of Cu-Pillar Structure Using Advanced Plating Method

Contact Info

Product

Resources

About