Proceedings IEEE European Test Workshop
DOI: 10.1109/etw.2000.873771
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Bridging the testing speed gap: design for delay testability

Abstract: The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a Design for Delay Testability technique such that high-speed ICs can be tested using inexpensive, lowspeed ATE. Also extensions for possible full BIST of delay faults are addressed.

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Cited by 5 publications
(4 citation statements)
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“…Indeed, pipelined and superscalar designs demonstrated to be random pattern resistant [2]. The use of hardware-based approaches, such as scan chains and BIST, even though consolidated in industry for integrated digital circuits, has proven to be often inadequate, since these techniques introduce excessive area overhead [1], require extreme power dissipation during the test application [13], and are often ineffective when testing delay-related faults [12].…”
Section: Introductionmentioning
confidence: 99%
“…Indeed, pipelined and superscalar designs demonstrated to be random pattern resistant [2]. The use of hardware-based approaches, such as scan chains and BIST, even though consolidated in industry for integrated digital circuits, has proven to be often inadequate, since these techniques introduce excessive area overhead [1], require extreme power dissipation during the test application [13], and are often ineffective when testing delay-related faults [12].…”
Section: Introductionmentioning
confidence: 99%
“…This architecture and its components have been described in detail and simulated in VHDL at system level and using HSPICE data for different blocks in previous work [3,4]. In this paper, the complete architecture has been simulated at circuit level, making use of HSPICE and using the 0.35 pm TSMC CMOS technology from MOSIS [12].…”
Section: The Dfdt Structure Usedmentioning
confidence: 99%
“…In this paper, the complete architecture has been simulated at circuit level, making use of HSPICE and using the 0.35 pm TSMC CMOS technology from MOSIS [12]. Readers are referred to [3,4,11] for more details on previous results. …”
Section: The Dfdt Structure Usedmentioning
confidence: 99%
“…Scan test does not excite fault conditions in a real-life environment (power, ground stress and noise). At-speed delay testing is severely constrained by the employed Automatic Test Equipment (ATE) features, which are frequently outpaced by new manufactured products (Speek, 2000). Conversely, due to the increased controllability achieved on the circuit, atspeed scan-based delay testing may identify as faulty some resources that would never affect the system's behavior (false paths) (Chen, 1993), thereby leading to yield loss.…”
Section: Introductionmentioning
confidence: 99%