“…Due to their high T G % 360 C, PI substrates with thickness ranging from %3 to 50lm are widely used. 83,145,191,193,[197][198][199][220][221][222][223] Polyarylate (PAR) foils have also been employed, 192,200,224,225 given their good temperature stability (T G % 330 C), combined with a colorless transparency in the visible range. If the semiconductor deposition is performed at lower temperatures ( 150 C), also PES foils (T G around 200 C) can be utilized.…”