2015
DOI: 10.1063/1.4914085
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Low-temperature spray-deposited indium oxide for flexible thin-film transistors and integrated circuits

Abstract: Indium oxide (In2O3) films were deposited by ultrasonic spray pyrolysis in ambient air and incorporated into bottom-gate coplanar and staggered thin-film transistors. As-fabricated devices exhibited electron-transporting characteristics with mobility values of 1 cm2V−1s−1 and 16 cm2V−1s−1 for coplanar and staggered architectures, respectively. Integration of In2O3 transistors enabled realization of unipolar inverters with high gain (5.3 V/V) and low-voltage operation. The low temperature deposition (≤250 °C) o… Show more

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Cited by 46 publications
(63 citation statements)
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“…Due to their properties and their availability, polymers are the natural choice and the most commonly used substrate materials. Among the different polymers, polyimide (PI) foils with thicknesses (t S ) between 5 lm and 125 lm are the most frequently utilized substrates, 135,145,152,157,158,160,165,172,177,180,184,188,189 together with PI and nano silica. 142,144 This is because of the numerous advantages of PI (commercially known as Kapton V R ), like a small coefficient of thermal expansion (CTE) of 12 Â 10 À6 K, a small humidity expansion coefficient (HEC) (9 Â 10 À6 %RH), a high T G of %360 C, and a surface roughness in the nanometer range.…”
Section: Methodsmentioning
confidence: 99%
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“…Due to their properties and their availability, polymers are the natural choice and the most commonly used substrate materials. Among the different polymers, polyimide (PI) foils with thicknesses (t S ) between 5 lm and 125 lm are the most frequently utilized substrates, 135,145,152,157,158,160,165,172,177,180,184,188,189 together with PI and nano silica. 142,144 This is because of the numerous advantages of PI (commercially known as Kapton V R ), like a small coefficient of thermal expansion (CTE) of 12 Â 10 À6 K, a small humidity expansion coefficient (HEC) (9 Â 10 À6 %RH), a high T G of %360 C, and a surface roughness in the nanometer range.…”
Section: Methodsmentioning
confidence: 99%
“…Finally, mechanically active multilayer substrates using a highly cross-linked hydrogel swelling layer and a stiff PI have been shown. Typical adhesion or buffer layers are made of silicon nitride (SiN x ), 92,106,113,114,140,[143][144][145][146]150,151,173,182,183 silicon oxide (SiO x ), 78,82,135,148,154,157,168,170,181,205 and photoresist sandwiched between SiN x and SiO x . 158 Organic materials, 78,82,136,148,154,157,168,170,181,205 in particular, SU8, 153 or PVP is especially well-suited as smoothing layers.…”
Section: Methodsmentioning
confidence: 99%
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