2014
DOI: 10.1002/adma.201400529
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Boost Up Mobility of Solution‐Processed Metal Oxide Thin‐Film Transistors via Confining Structure on Electron Pathways

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Cited by 181 publications
(118 citation statements)
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“…The bilayer channel scheme has received increasing attention among n-type oxide TFTs as it was found to be more promising than single-channel TFTs [57][58][59]. As a first attempt to examine such structure on p-type oxide TFTs, we explored the possibility of fabricating p-type transparent bilayer TFTs that consist of a combination of Cu 2 O and SnO as two separate active layers [60,61].…”
Section: Cu 2 O/sno Bilayer Tfts and Cmosmentioning
confidence: 99%
“…The bilayer channel scheme has received increasing attention among n-type oxide TFTs as it was found to be more promising than single-channel TFTs [57][58][59]. As a first attempt to examine such structure on p-type oxide TFTs, we explored the possibility of fabricating p-type transparent bilayer TFTs that consist of a combination of Cu 2 O and SnO as two separate active layers [60,61].…”
Section: Cu 2 O/sno Bilayer Tfts and Cmosmentioning
confidence: 99%
“…[30][31][32] Oxide semiconductors are leading candidates for n-type transistors and microelectronics with high yield and uniformity. [33][34][35][36] The high electron mobilities (> 10 cm 2 V −1 s −1 ) of oxide FETs guarantee high sensitivity and high signal-to-noise ratio in biosensing. 37,38 Also, the high tolerance of structural defects and the minimized band tail trapping 39 of oxide semiconductors allow oxide FETs to be processed at low temperature (< 350 o C) and solution processing is a convenient and feasible approach to deposit high-performance oxide semiconductors on a large scale at low cost.…”
mentioning
confidence: 99%
“…1 Recently, the solution processes have been developing rapidly due to their low cost and facile nature. [2][3][4][5][6] Normally, chemical conversion subsequent to deposition requires significant thermal energy, inevitably involving high temperature (>400°C) annealing to eliminate unwanted carbon, oxygen, hydrogen, and anions as the film densifies toward the target metal oxide. 7 Consequently, due to the high temperature requirements, substrate selection is limited, particularly polymer substrates for flexible electronics are largely excluded.…”
mentioning
confidence: 99%