Bonding of gold wire to electrolytic and immersion gold-plated FR-4 laminates at low temperature

Ho, Hsinshen; Yeo, Chee Keng; Chan, S.L.H.; Wong, Nelson; Ng, C.F.; Ramanujan, C.S.; Li, K.

doi:10.1109/eptc.1998.756000

Cited by 3 publications

(2 citation statements)

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“…The organic contaminants of a few nanometers in thickness are present on the bond pad surface, which originate from additives in the plating bath, outgases of die attach and solder mask curing, or exposure to air [4]- [6]. The contaminant layer not only prevents intimate contacts and interdiffusion from taking place between the wire and bond pad surface [7]- [10], but also reduces the temperature rise arising from ultrasonic scrubbing [8], thereby requiring a higher activation energy to be supplied by external heating for making a successful bond [11].…”

Section: Effect Of Plasma Treatment Of Au-ni-cu Bond Pads On Process mentioning

confidence: 99%

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Chan

Kim

Liu

et al. 2005

IEEE Trans. Adv. Packag.

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The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.Index Terms-Au-Ni-Cu bond pad, Au wire bond, plasma treatment, process window, surface energy.

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Section: Effect Of Plasma Treatment Of Au-ni-cu Bond Pads On Process mentioning

confidence: 99%

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Chan

Kim

Liu

et al. 2005

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

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“…Thus, wire bonding below 100°C would provide more cost-effective benefit when low Tg substrate is being employed. However, it should be noted that it is relatively easy to bond, when bonding at a temperature of 200°C above ambient (Ho, 1998) because the additional activation energy required has been drastically reduced by the simple application of heat. In the case of BT laminate, the additional heat is not desirable due to its low glass transition temperature, Tg.…”

Section: Introductionmentioning

confidence: 99%