Extended Abstracts of the 2013 International Conference on Solid State Devices and Materials 2013
DOI: 10.7567/ssdm.2013.g-6-1
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BEOL-Transistor Technology with InGaZnO channel for High/Low Voltage Bridging I/Os

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Cited by 3 publications
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“…Note that, besides the sensor applications discussed here, InGaZnO TFTs have also been studied for use in some other electronic devices like power devices 61,62) and memory devices. 63,64) These devices also utilize some of the specific features of InGaZnO TFTs, i.e., larger bandgap and much lower OFF current in comparison with Si-based TFTs and FETs.…”
Section: Other Sensor Applications Of Ingazno Tftsmentioning
confidence: 99%
“…Note that, besides the sensor applications discussed here, InGaZnO TFTs have also been studied for use in some other electronic devices like power devices 61,62) and memory devices. 63,64) These devices also utilize some of the specific features of InGaZnO TFTs, i.e., larger bandgap and much lower OFF current in comparison with Si-based TFTs and FETs.…”
Section: Other Sensor Applications Of Ingazno Tftsmentioning
confidence: 99%
“…Demands for enhancing the device performance of oxide semiconductor thin-film transistors (TFTs) have been increasing in flat panel display (FPD) industries due to the technical needs for ultrahigh resolution, larger area, good form factor, and lower power consumption. In particular, In–Ga–Zn–O (IGZO) has been mainly employed as a channel material for backplane TFTs of FPDs owing to its advantages such as low process temperature, superior electrical properties, and optical transparency along with amorphous characteristics. Thus, the IGZO thin films have also been widely developed for various electronic device applications including flexible displays, , power devices, thermoelectrical devices, and nonvolatile memories. , The IGZO thin films have conventionally been prepared by the sputtering technique. , However, for the sputtering method, plasma damages may be induced to the layers underneath active channel, and controllability and reproducibility of the cation compositions may be limited to be stably secured owing to the aging of mass-producible single target. Therefore, the sputtering technique cannot be appropriate for the formation of IGZO active channel layers for given target applications demanding complete conformality and precise composition control of deposited thin films.…”
Section: Introductionmentioning
confidence: 99%
“…1,2) Recently, back-end-of-line (BEOL) compatible oxide-based TFTs have also been explored for several fields which could potentially be implemented in large-scaleintegrated (LSI) chips, including high-frequency microwave devices, select transistors for three-dimentional stacking memory arrays, complementary metal-oxide-semiconductor (CMOS) image sensors, and high-voltage control circuit blocks. [3][4][5][6][7] These applications are feasible mainly because the oxide-based TFTs can be fabricated at low temperatures (<400 °C) with BEOL-compatible mature tools and processes. Moreover, the oxide materials exhibit appealing properties like wide bandgap, transparency, and good carrier mobility.…”
Section: Introductionmentioning
confidence: 99%
“…In this regards, n-channel unipolar as well as CMOS inverters have been explored recently. [8][9][10] Theoretically CMOS is the most ideal among various logic gate technologies in terms of power dissipation and performance, however, the lack of high-performance p-channel oxide devices hinders its development. For the unipolar approaches, the combination of a depletion-mode TFT as the load and an enhancement-mode TFT as the driver have been demonstrated to exhibit superior performance.…”
Section: Introductionmentioning
confidence: 99%