“…Demands for enhancing the device performance of oxide semiconductor thin-film transistors (TFTs) have been increasing in flat panel display (FPD) industries due to the technical needs for ultrahigh resolution, larger area, good form factor, and lower power consumption. − In particular, In–Ga–Zn–O (IGZO) has been mainly employed as a channel material for backplane TFTs of FPDs owing to its advantages such as low process temperature, superior electrical properties, and optical transparency along with amorphous characteristics. − Thus, the IGZO thin films have also been widely developed for various electronic device applications including flexible displays, , power devices, thermoelectrical devices, and nonvolatile memories. , The IGZO thin films have conventionally been prepared by the sputtering technique. , However, for the sputtering method, plasma damages may be induced to the layers underneath active channel, and controllability and reproducibility of the cation compositions may be limited to be stably secured owing to the aging of mass-producible single target. Therefore, the sputtering technique cannot be appropriate for the formation of IGZO active channel layers for given target applications demanding complete conformality and precise composition control of deposited thin films.…”