Batch transfer of microstructures using flip-chip solder bonding

Singh, A.; Horsley, David A.; Cohn, Michael B.; Pisano, Albert P.; Howe, Roger T.

doi:10.1109/84.749399

Cited by 101 publications

(48 citation statements)

References 8 publications

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“…The magnetic torque applied to the part is computed using (1)(2)(3)(4)(5)(6)(7)(8). Figure 4 shows the magnetic torque as a function of the angle ranging from 0 to 180° between the length direction of the part and the magnet.…”

Section: Discussionmentioning

confidence: 99%

“…Different strategies are used to assemble meso and micro scale components in complex heterogeneous integrated systems, including conventional pick and place robotic assembly [1][2][3], microstructure transfer between aligned wafers [4,5], and dynamic self-assembly [6]. Robotic assembly is a serial process and can be subject to adhesion forces resulting from the handling and positioning of micro/nano components.…”

Section: Introductionmentioning

confidence: 99%

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Analysis of Magnetic Assisted Assembly of Meso-Scale Parts

Wang

2014

AUSMT

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Abstract:This paper presents an analysis of the self-assembly of millimeter-sized, rectangular-shaped parts floating on a molten solder-air interface under a rotating external magnetic field. For part at the millimeter scale, gravitational effects may not be negligible compared to interfacial surface energy, resulting in a non-spontaneous self-assembly process. A rotating magnetic field produces a torque which rotates the magnetized parts into their specific in-plane orientations, and are then fixed in these orientations by the surface tension of the molten solder. A theoretical model for estimating the magnetic torque is developed. Experiments are carried out on glass substrates with patterned copper foil. Rectangular binding sites are the only hydrophilic areas on the substrate. By a simple coating process, molten solder wets only the binding sites on the substrate. Parts with orientation angles up to 90°can be rotated and translated to align with the binding sites by the magnetic torque and surface tension.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Analysis of Magnetic Assisted Assembly of Meso-Scale Parts

Wang

2014

AUSMT

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“…In addition to fully planar integration methods, bonding processes, in which circuits and µmechan-ics are merged by bonding one onto the wafer of the other, are presently undergoing a resurgence [29]. In particular, the advent of more sophisticated aligner-bonder instruments are now making possible much smaller bond pad sizes, which soon may enable wafer-level bonding with bond pad sizes small enough to compete with fully planar processed merging strategies in interface capacitance values.…”

Section: Circuits/mems Merging Technologiesmentioning

confidence: 99%

“…minimize Q-degrading anchor losses experienced by previous bonding-based methods [29] by bonding platforms housing resonators, instead of directly bonding the anchors of resonators; and (3) It constitutes not only a wafer-scale batch approach, but also a repeatable approach, where a step-and-repeat procedure can be used to allow a single MEMS wafer to service several transistor wafers. From a broader perspective, the integration techniques discussed above are really methods for achieving low capacitance packaging of microelectromechanical systems.…”

Section: Circuits/mems Merging Technologiesmentioning

confidence: 99%

Vibrating RF MEMS for Low Power Communications

Nguyen

2002

MRS Proc.

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Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumption. Technologies that integrate MEMS and transistor circuits into single-chip systems are then reviewed with an eye towards the possibility of single-chip communication transceivers.

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“…Parallel microassembly systems perform the assembly process at multiple assembly sites simultaneously. One of the main parallel approaches is known as "flip-chip" or "batch transfer" microassembly [1], [2]. It can be used to fabricate planar, multilayer assemblies and can combine chips fabricated by different processes.…”

Section: Introductionmentioning

confidence: 99%

Microassembly of 3-D Microstructures Using a Compliant, Passive Microgripper

Dechev

Cleghorn

Mills

2004

J. Microelectromech. Syst.

209

154

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Abstract-This paper describes a novel microassembly system that can be used to construct out-of-plane three-dimensional (3-D) microstructures. The system makes use of a surface-micromachined microgripper that is solder bonded to a robotic manipulator. The microgripper is able to grasp a micropart, remove it from the chip, reorient it about two independent axes, translate it along the , and axes to a secondary location, and join it to another micropart. In this way, out-of-plane 3-D microstructures can be assembled from a set of initially planar and parallel surface micromachined microparts. The microgripper is 380 410 m in size. It utilizes three geometric features for operation: 1) compliant beams to allow for deflection at the grasping tips; 2) self-tightening geometry during grasping; and 3) 3-D interlocking geometry to secure a micropart after the grasp. Each micropart has three geometric features built into its body. The first is the interlock interface feature that allows it to be grasped by the microgripper. The second is a tether feature that secures the micropart to the substrate, and breaks away after the microgripper has grasped the micropart. The third is the snap-lock feature, which is used to join the micropart to other microparts.[1061]Index Terms-Compliant, joint, microelectromechanical systems (MEMS), microgripper, microassembly, microstructure, micropart, snap-lock microjoint, three-dimensional (3-D).

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Batch transfer of microstructures using flip-chip solder bonding

Cited by 101 publications

References 8 publications

Analysis of Magnetic Assisted Assembly of Meso-Scale Parts

Analysis of Magnetic Assisted Assembly of Meso-Scale Parts

Vibrating RF MEMS for Low Power Communications

Microassembly of 3-D Microstructures Using a Compliant, Passive Microgripper

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