Microassembly promises to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial and parallel microassembly. The former extends conventional "pick and place" assembly into the micro-domain, where surface forces play a dominant role. Parallel assembly involves the simultaneous precise organization of an ensemble of micro components. This can be achieved by microstructure transfer between aligned wafers or arrays of binding sites that trap an initially random collection of parts. Binding sites can be micromachined cavities or electrostatic traps; short-range attractive forces and random agitation of the parts serve to fill the sites. Microassembly strategies should furnish reliable mechanical bonds and electrical interconnection between the micropart and the target substrate or subassembly.
Angular electrostatic microactuators suitable for use in a two-stage servo system for magnetic disk drives have been fabricated from molded chemical-vapor-deposited (CVD) polysilicon using the HexSil process. A 2.6-mm-diameter device has been shown to be capable of positioning the read/write elements of a 30% picoslider over a 6 6 61m range, with a predicted bandwidth of 2 kHz. The structures are formed by depositing polysilicon via CVD into deep trenches etched into a silicon mold wafer. Upon release, the actuators are assembled onto a target wafer using a solder bond. The solder-bonding process will provide easy integration of mechanical structures with integrated circuits, allowing separate optimization of the circuit and structure fabrication processes. An advantage of HexSil is that once the mold wafer has undergone the initial plasma etching, it may be reused for subsequent polysilicon depositions, amortizing the cost of the deep-trench etching over many structural runs and thereby significantly reducing the cost of finished actuators. Furthermore, 100-m-high structures may be made from a 3-m deposition of polysilicon, increasing overall fabrication speed. [256]
A hologram fully encodes a three-dimensional light field by imprinting the interference between the field and a reference beam in a recording medium. Here we show that two collinear pump lasers with different foci overlapped in a gas jet produce a holographic plasma lens capable of focusing or collimating a probe laser at intensities several orders-of-magnitude higher than the limits of a nonionized optic. We outline the theory of these diffractive plasma lenses and present simulations for two plasma mechanisms that allow their construction: spatially varying ionization and ponderomotively driven ion-density fluctuations. Damage-resistant plasma optics are necessary for manipulating highintensity light, and divergence control of high-intensity pulses -provided by holographic plasma lenses -will be a critical component of high-power plasma-based lasers.
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